Invention Grant
- Patent Title: Connection by fitting together two soldered inserts
- Patent Title (中): 通过将两个焊接插入件组装在一起进行连接
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Application No.: US12558149Application Date: 2009-09-11
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Publication No.: US08093728B2Publication Date: 2012-01-10
- Inventor: Francois Marion
- Applicant: Francois Marion
- Applicant Address: FR
- Assignee: Commissariat a l'Energie Atomique
- Current Assignee: Commissariat a l'Energie Atomique
- Current Assignee Address: FR
- Agency: Heslin Rothenberg Farley & Mesiti P.C.
- Agent Victor A. Cardona
- Priority: FR0856465 20080925
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52
Abstract:
A connection device between two components includes a hollow conductive insert, into which is fitted another conductive insert, the electrical connection between the two inserts being provided by means of a solder element.
Public/Granted literature
- US20100072631A1 CONNECTION BY FITTING TOGETHER TWO SOLDERED INSERTS Public/Granted day:2010-03-25
Information query
IPC分类:
