发明授权
- 专利标题: Prepreg and its application products for low thermal expansion and low dielectric tangent
- 专利标题(中): 预浸料及其低热膨胀和低介质切线的应用产品
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申请号: US12353357申请日: 2009-01-14
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公开(公告)号: US08115105B2公开(公告)日: 2012-02-14
- 发明人: Satoru Amou , Hiroshi Shimizu , Akinori Hanawa
- 申请人: Satoru Amou , Hiroshi Shimizu , Akinori Hanawa
- 申请人地址: JP Tokyo
- 专利权人: Hitachi Chemical Co., Ltd.
- 当前专利权人: Hitachi Chemical Co., Ltd.
- 当前专利权人地址: JP Tokyo
- 代理机构: Antonelli, Terry, Stout & Kraus, LLP.
- 优先权: JP2008-005620 20080115
- 主分类号: H05K1/00
- IPC分类号: H05K1/00
摘要:
A prepreg comprising composite woven cloth or non-woven cloth composed of glass fiber and polyolefin fiber that are a main part of the cloth and a thermosetting resin composition that gives a cured product having a low thermal expansion coefficient, wherein the thermal expansion coefficient of the cured resin composition at 50 to 100° C. is 50 ppm/° C. or less, is disclosed. A printed circuit board, multi layered circuit board, and electronic part are disclosed.