发明授权
US08115105B2 Prepreg and its application products for low thermal expansion and low dielectric tangent 有权
预浸料及其低热膨胀和低介质切线的应用产品

Prepreg and its application products for low thermal expansion and low dielectric tangent
摘要:
A prepreg comprising composite woven cloth or non-woven cloth composed of glass fiber and polyolefin fiber that are a main part of the cloth and a thermosetting resin composition that gives a cured product having a low thermal expansion coefficient, wherein the thermal expansion coefficient of the cured resin composition at 50 to 100° C. is 50 ppm/° C. or less, is disclosed. A printed circuit board, multi layered circuit board, and electronic part are disclosed.
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