发明授权
- 专利标题： Integrated circuit package system with thin profile
- 专利标题（中）： 具有薄型的集成电路封装系统
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申请号： US11750218申请日： 2007-05-17
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公开(公告)号： US08115305B2公开(公告)日： 2012-02-14
- 发明人: Zigmund Ramirez Camacho , Henry Descalzo Bathan , Abelardo Hadap Advincula , Lionel Chien Hui Tay
- 申请人： Zigmund Ramirez Camacho , Henry Descalzo Bathan , Abelardo Hadap Advincula , Lionel Chien Hui Tay
- 申请人地址： SG Singapore
- 专利权人： Stats Chippac Ltd.
- 当前专利权人： Stats Chippac Ltd.
- 当前专利权人地址： SG Singapore
- 代理商 Mikio Ishimaru
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L21/44
摘要：
An integrated circuit package system is provided including attaching an external interconnect on a tape; attaching a backside element on the tape adjacent to the external interconnect; attaching an integrated circuit die with the backside element, the backside element is on a first passive side of the integrated circuit die; connecting a first active side of the integrated circuit die and the external interconnect; and forming a first encapsulation over the integrated circuit die with the backside element exposed.
公开/授权文献
- US20080284002A1 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH THIN PROFILE 公开/授权日：2008-11-20
信息查询
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