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公开(公告)号：US20080284002A1
公开(公告)日：2008-11-20
申请号：US11750218
申请日：2007-05-17
申请人： Zigmund Ramirez Camacho , Henry Descalzo Bathan , Abelardo Hadap Advincula , Lionel Chien Hui Tay
发明人： Zigmund Ramirez Camacho , Henry Descalzo Bathan , Abelardo Hadap Advincula , Lionel Chien Hui Tay
IPC分类号： H01L23/28
CPC分类号： H01L21/568 , H01L21/6835 , H01L23/3107 , H01L23/49541 , H01L23/49548 , H01L23/49551 , H01L23/49575 , H01L24/48 , H01L2224/32145 , H01L2224/45014 , H01L2224/48091 , H01L2224/48095 , H01L2224/48247 , H01L2224/48463 , H01L2224/48465 , H01L2224/48471 , H01L2224/48479 , H01L2224/73265 , H01L2224/85001 , H01L2924/00014 , H01L2924/14 , H01L2924/1461 , H01L2924/181 , H01L2924/18165 , H01L2924/00 , H01L2224/48227 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2224/4554
摘要： An integrated circuit package system is provided including attaching an external interconnect on a tape; attaching a backside element on the tape adjacent to the external interconnect; attaching an integrated circuit die with the backside element, the backside element is on a first passive side of the integrated circuit die; connecting a first active side of the integrated circuit die and the external interconnect; and forming a first encapsulation over the integrated circuit die with the backside element exposed.
摘要翻译： 提供了一种集成电路封装系统，包括将外部互连件附接在磁带上; 将背面元件附接在与外部互连件相邻的带上; 将集成电路裸片与后侧元件连接，后侧元件位于集成电路管芯的第一被动侧; 连接集成电路管芯的第一有源侧和外部互连; 以及在所述背面元件暴露的情况下在所述集成电路裸片上形成第一封装。
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公开(公告)号：US08115305B2
公开(公告)日：2012-02-14
申请号：US11750218
申请日：2007-05-17
申请人： Zigmund Ramirez Camacho , Henry Descalzo Bathan , Abelardo Hadap Advincula , Lionel Chien Hui Tay
发明人： Zigmund Ramirez Camacho , Henry Descalzo Bathan , Abelardo Hadap Advincula , Lionel Chien Hui Tay
CPC分类号： H01L21/568 , H01L21/6835 , H01L23/3107 , H01L23/49541 , H01L23/49548 , H01L23/49551 , H01L23/49575 , H01L24/48 , H01L2224/32145 , H01L2224/45014 , H01L2224/48091 , H01L2224/48095 , H01L2224/48247 , H01L2224/48463 , H01L2224/48465 , H01L2224/48471 , H01L2224/48479 , H01L2224/73265 , H01L2224/85001 , H01L2924/00014 , H01L2924/14 , H01L2924/1461 , H01L2924/181 , H01L2924/18165 , H01L2924/00 , H01L2224/48227 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2224/4554
摘要： An integrated circuit package system is provided including attaching an external interconnect on a tape; attaching a backside element on the tape adjacent to the external interconnect; attaching an integrated circuit die with the backside element, the backside element is on a first passive side of the integrated circuit die; connecting a first active side of the integrated circuit die and the external interconnect; and forming a first encapsulation over the integrated circuit die with the backside element exposed.
摘要翻译： 提供了一种集成电路封装系统，包括将外部互连件附接在磁带上; 将背面元件附接在与外部互连件相邻的带上; 将集成电路裸片与后侧元件连接，后侧元件位于集成电路管芯的第一被动侧; 连接集成电路管芯的第一有源侧和外部互连; 以及在所述背面元件暴露的情况下在所述集成电路裸片上形成第一封装。
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3.发明申请公开(公告)号：US20080308933A1
公开(公告)日：2008-12-18
申请号：US11763154
申请日：2007-06-14
CPC分类号： H01L24/91 , H01L23/3107 , H01L23/4951 , H01L23/49551 , H01L23/49575 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L25/03 , H01L25/0657 , H01L29/0657 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/13144 , H01L2224/16245 , H01L2224/26145 , H01L2224/32145 , H01L2224/45014 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48145 , H01L2224/48177 , H01L2224/48247 , H01L2224/4826 , H01L2224/73207 , H01L2224/73265 , H01L2225/0651 , H01L2225/06517 , H01L2225/06527 , H01L2225/06558 , H01L2225/06572 , H01L2924/00014 , H01L2924/01013 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/078 , H01L2924/10158 , H01L2924/14 , H01L2924/15311 , H01L2924/1532 , H01L2924/15787 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2924/10155 , H01L2224/05599 , H01L2224/45015 , H01L2924/207 , H01L2224/0555 , H01L2224/0556 , H01L2924/206
摘要： An integrated circuit package system is provided including forming an external interconnect having a tip without a die-attach paddle; mounting a first integrated circuit device structure having a conductive ball over the tip; connecting a first wire between the first integrated circuit device structure and under the tip; and encapsulating the first integrated circuit device structure, the first wire, and the external interconnect with the external interconnect partially exposed.
摘要翻译： 提供了一种集成电路封装系统，包括形成具有尖端的外部互连件，而没有管芯附接的焊盘; 在所述尖端上安装具有导电球的第一集成电路器件结构; 在第一集成电路器件结构和尖端之间连接第一线; 并且将第一集成电路器件结构，第一引线和外部互连件与外部互连部分地暴露在一起。
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公开(公告)号：US20080237816A1
公开(公告)日：2008-10-02
申请号：US11694921
申请日：2007-03-30
IPC分类号： H01L23/495 , H01L21/00
CPC分类号： H01L21/565 , H01L23/3107 , H01L24/73 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/14 , H01L2924/181 , H01L2924/00012 , H01L2924/00014 , H01L2924/00
摘要： An integrated circuit package system is provided including forming a lead frame includes forming a mold gate, providing a first surface, and providing a second surface opposite the first surface; and forming angled gate sides facing each other in the mold gate between the first surface and the second surface.
摘要翻译： 提供一种集成电路封装系统，包括形成引线框架，包括形成模具门，提供第一表面，并提供与第一表面相对的第二表面; 以及在所述第一表面和所述第二表面之间的模具浇口中形成彼此相对的成角度的浇口侧。
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公开(公告)号：US08207600B2
公开(公告)日：2012-06-26
申请号：US11694921
申请日：2007-03-30
IPC分类号： H01L23/495
CPC分类号： H01L21/565 , H01L23/3107 , H01L24/73 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/14 , H01L2924/181 , H01L2924/00012 , H01L2924/00014 , H01L2924/00
摘要： An integrated circuit package system is provided including forming a lead frame includes forming a mold gate, providing a first surface, and providing a second surface opposite the first surface; and forming angled gate sides facing each other in the mold gate between the first surface and the second surface.
摘要翻译： 提供一种集成电路封装系统，包括形成引线框架，包括形成模具门，提供第一表面，并提供与第一表面相对的第二表面; 以及在所述第一表面和所述第二表面之间的模具浇口中形成彼此相对的成角度的浇口侧。
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