公开(公告)号：US20080284002A1

公开(公告)日：2008-11-20

申请号：US11750218

申请日：2007-05-17

申请人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Abelardo Hadap Advincula ,  Lionel Chien Hui Tay

发明人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Abelardo Hadap Advincula ,  Lionel Chien Hui Tay

IPC分类号： H01L23/28

CPC分类号： H01L21/568 ,  H01L21/6835 ,  H01L23/3107 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49551 ,  H01L23/49575 ,  H01L24/48 ,  H01L2224/32145 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/73265 ,  H01L2224/85001 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/00 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/4554

摘要： An integrated circuit package system is provided including attaching an external interconnect on a tape; attaching a backside element on the tape adjacent to the external interconnect; attaching an integrated circuit die with the backside element, the backside element is on a first passive side of the integrated circuit die; connecting a first active side of the integrated circuit die and the external interconnect; and forming a first encapsulation over the integrated circuit die with the backside element exposed.

摘要翻译： 提供了一种集成电路封装系统，包括将外部互连件附接在磁带上; 将背面元件附接在与外部互连件相邻的带上; 将集成电路裸片与后侧元件连接，后侧元件位于集成电路管芯的第一被动侧; 连接集成电路管芯的第一有源侧和外部互连; 以及在所述背面元件暴露的情况下在所述集成电路裸片上形成第一封装。

公开(公告)号：US08115305B2

公开(公告)日：2012-02-14

申请号：US11750218

申请日：2007-05-17

申请人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Abelardo Hadap Advincula ,  Lionel Chien Hui Tay

发明人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Abelardo Hadap Advincula ,  Lionel Chien Hui Tay

IPC分类号： H01L23/48 ,  H01L21/44

CPC分类号： H01L21/568 ,  H01L21/6835 ,  H01L23/3107 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49551 ,  H01L23/49575 ,  H01L24/48 ,  H01L2224/32145 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/73265 ,  H01L2224/85001 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/00 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/4554

摘要： An integrated circuit package system is provided including attaching an external interconnect on a tape; attaching a backside element on the tape adjacent to the external interconnect; attaching an integrated circuit die with the backside element, the backside element is on a first passive side of the integrated circuit die; connecting a first active side of the integrated circuit die and the external interconnect; and forming a first encapsulation over the integrated circuit die with the backside element exposed.

摘要翻译： 提供了一种集成电路封装系统，包括将外部互连件附接在磁带上; 将背面元件附接在与外部互连件相邻的带上; 将集成电路裸片与后侧元件连接，后侧元件位于集成电路管芯的第一被动侧; 连接集成电路管芯的第一有源侧和外部互连; 以及在所述背面元件暴露的情况下在所述集成电路裸片上形成第一封装。

公开(公告)号：US07732901B2

公开(公告)日：2010-06-08

申请号：US12050428

申请日：2008-03-18

申请人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Abelardo Hadap Advincula, Jr. ,  Lionel Chien Hui Tay

发明人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Abelardo Hadap Advincula, Jr. ,  Lionel Chien Hui Tay

IPC分类号： H01L23/495

CPC分类号： H01L23/49541 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49558 ,  H01L23/49861 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48253 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01027 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

摘要： An integrated circuit package system comprising: forming a finger; forming a die pad adjacent the finger; applying a fill material around the finger and the die pad; forming a cavity in the finger and fill material; and attaching an integrated circuit die over the die pad adjacent the finger with the fill material.

摘要翻译： 一种集成电路封装系统，包括：形成手指; 形成与所述手指相邻的芯片焊盘; 在手指和芯片垫周围施加填充材料; 在手指中形成空腔并填充材料; 以及使用所述填充材料将集成电路管芯附接在所述手指附近的所述管芯焊盘上。

公开(公告)号：US08421198B2

公开(公告)日：2013-04-16

申请号：US11856841

申请日：2007-09-18

申请人： Lionel Chien Hui Tay ,  Zigmund Ramirez Camacho ,  Abelardo Hadap Advincula, Jr.

发明人： Lionel Chien Hui Tay ,  Zigmund Ramirez Camacho ,  Abelardo Hadap Advincula, Jr.

IPC分类号： H01L23/495

CPC分类号： H01L23/49541 ,  H01L23/3107 ,  H01L23/49548 ,  H01L24/16 ,  H01L24/48 ,  H01L2224/16 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system includes: connecting an integrated circuit die and external interconnects; forming an encapsulation over the integrated circuit die and a portion of the external interconnects; and forming an isolation hole between the external interconnects and into a side of the encapsulation exposing the external interconnects.

摘要翻译： 集成电路封装系统包括：连接集成电路管芯和外部互连; 在所述集成电路管芯和所述外部互连的一部分上形成封装; 以及在所述外部互连件之间形成隔离孔并且进入所述封装的暴露所述外部互连的一侧。

公开(公告)号：US20080308933A1

公开(公告)日：2008-12-18

申请号：US11763154

申请日：2007-06-14

申请人： Lionel Chien Hui Tay ,  Zigmund Ramirez Camacho ,  Abelardo Hadap Advincula

发明人： Lionel Chien Hui Tay ,  Zigmund Ramirez Camacho ,  Abelardo Hadap Advincula

IPC分类号： H01L23/48 ,  H01L21/60

CPC分类号： H01L24/91 ,  H01L23/3107 ,  H01L23/4951 ,  H01L23/49551 ,  H01L23/49575 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/03 ,  H01L25/0657 ,  H01L29/0657 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13144 ,  H01L2224/16245 ,  H01L2224/26145 ,  H01L2224/32145 ,  H01L2224/45014 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48177 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06558 ,  H01L2225/06572 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/078 ,  H01L2924/10158 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/10155 ,  H01L2224/05599 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/0555 ,  H01L2224/0556 ,  H01L2924/206

摘要： An integrated circuit package system is provided including forming an external interconnect having a tip without a die-attach paddle; mounting a first integrated circuit device structure having a conductive ball over the tip; connecting a first wire between the first integrated circuit device structure and under the tip; and encapsulating the first integrated circuit device structure, the first wire, and the external interconnect with the external interconnect partially exposed.

摘要翻译： 提供了一种集成电路封装系统，包括形成具有尖端的外部互连件，而没有管芯附接的焊盘; 在所述尖端上安装具有导电球的第一集成电路器件结构; 在第一集成电路器件结构和尖端之间连接第一线; 并且将第一集成电路器件结构，第一引线和外部互连件与外部互连部分地暴露在一起。

公开(公告)号：US20090072365A1

公开(公告)日：2009-03-19

申请号：US11856841

申请日：2007-09-18

申请人： Lionel Chien Hui Tay ,  Zigmund Ramirez Camacho ,  Abelardo Hadap Advincula, JR.

发明人： Lionel Chien Hui Tay ,  Zigmund Ramirez Camacho ,  Abelardo Hadap Advincula, JR.

IPC分类号： H01L23/495 ,  H01L21/56

CPC分类号： H01L23/49541 ,  H01L23/3107 ,  H01L23/49548 ,  H01L24/16 ,  H01L24/48 ,  H01L2224/16 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system includes: connecting an integrated circuit die and external interconnects; forming an encapsulation over the integrated circuit die and a portion of the external interconnects; and forming an isolation hole between the external interconnects and into a side of the encapsulation exposing the external interconnects.

摘要翻译： 集成电路封装系统包括：连接集成电路管芯和外部互连; 在所述集成电路管芯和所述外部互连的一部分上形成封装; 以及在所述外部互连件之间形成隔离孔并且进入所述封装的暴露所述外部互连的一侧。

公开(公告)号：US07919850B2

公开(公告)日：2011-04-05

申请号：US12331416

申请日：2008-12-09

申请人： Arnel Senosa Trasporto ,  Lionel Chien Hui Tay ,  Zigmund Ramirez Camacho ,  Abelardo Hadap Advincula, Jr.

发明人： Arnel Senosa Trasporto ,  Lionel Chien Hui Tay ,  Zigmund Ramirez Camacho ,  Abelardo Hadap Advincula, Jr.

IPC分类号： H01L23/04 ,  H01L23/02

CPC分类号： H01L23/49548 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/4952 ,  H01L23/49531 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/03 ,  H01L25/105 ,  H01L2224/05553 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2225/06568 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a lead; mounting an inner package so that the lead is peripheral to the inner package, and the inner package having a connection pad; forming an exposed terminal interconnect on the connection pad; and encapsulating the inner package, and partially encapsulating the exposed terminal interconnect with an encapsulation.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供引线; 安装内部封装，使得引线是内部封装的周边，并且内部封装具有连接焊盘; 在连接焊盘上形成暴露的端子互连; 并封装内部封装，并用封装部分地封装暴露的端子互连。

公开(公告)号：US20090085181A1

公开(公告)日：2009-04-02

申请号：US11863700

申请日：2007-09-28

申请人： Abelardo Hadap Advincula, JR. ,  Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Jairus Legaspi Pisigan

发明人： Abelardo Hadap Advincula, JR. ,  Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Jairus Legaspi Pisigan

IPC分类号： H01L23/495 ,  H01L21/58

CPC分类号： H01L23/49575 ,  H01L23/49503 ,  H01L24/28 ,  H01L24/29 ,  H01L24/31 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/05554 ,  H01L2224/2919 ,  H01L2224/29288 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/0665 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system includes providing die; forming leads adjacent the die; forming a die paddle adjacent the leads with the die thereover; and forming a cavity for isolating one of the die and a die attach segment of the die paddle.

摘要翻译： 集成电路封装系统包括提供裸片; 在模具附近形成引线; 在其上与模具形成邻近引线的芯片; 以及形成用于隔离所述管芯和所述管芯焊盘的管芯附接部分中的一个的腔。

公开(公告)号：US08941219B2

公开(公告)日：2015-01-27

申请号：US13080469

申请日：2011-04-05

申请人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Lionel Chien Hui Tay ,  Jairus Legaspi Pisigan

发明人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Lionel Chien Hui Tay ,  Jairus Legaspi Pisigan

IPC分类号： H01L23/495 ,  H01L21/48 ,  H01L23/31 ,  H01L23/00 ,  H01L25/10

CPC分类号： H01L23/49551 ,  H01L21/4828 ,  H01L23/3107 ,  H01L23/495 ,  H01L24/16 ,  H01L24/29 ,  H01L24/48 ,  H01L24/49 ,  H01L25/105 ,  H01L2224/04042 ,  H01L2224/16145 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49 ,  H01L2224/73265 ,  H01L2224/85455 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/013 ,  H01L2924/00012 ,  H01L2224/0401

摘要： An integrated circuit package system includes: interconnection pads; a first device mounted below the interconnection pads; a bond wire, or a solder ball connecting the first device to the interconnection pads; a lead connected to the interconnection pad or to the first device; an encapsulation having a top surface encapsulating the first device; and a recess in the top surface of the encapsulation with the interconnection pads exposed therefrom.

摘要翻译： 集成电路封装系统包括：互连焊盘; 安装在互连焊盘下方的第一器件; 接合线或将第一器件连接到互连焊盘的焊球; 连接到互连衬垫或第一器件的引线; 封装，其具有封装所述第一器件的顶表面; 以及在封装的顶表面中的凹槽，其中互连焊盘从其暴露。

公开(公告)号：US08937393B2

公开(公告)日：2015-01-20

申请号：US11744062

申请日：2007-05-03

申请人： Henry Descalzo Bathan ,  Zigmund Ramirez Camacho ,  Lionel Chien Hui Tay ,  Frederick Rodriguez Dahilig

发明人： Henry Descalzo Bathan ,  Zigmund Ramirez Camacho ,  Lionel Chien Hui Tay ,  Frederick Rodriguez Dahilig

IPC分类号： H01L21/683 ,  H01L21/56 ,  H01L23/31 ,  H01L23/495 ,  H01L23/00

CPC分类号： H01L23/49575 ,  H01L21/565 ,  H01L21/6835 ,  H01L23/3107 ,  H01L24/48 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system is provided including connecting an integrated circuit die with an external interconnect, forming a first encapsulation having a device cavity with the integrated circuit die therein, mounting a device in the device cavity over the integrated circuit die, and forming a cover over the device and the first encapsulation.

摘要翻译： 提供一种集成电路封装系统，包括将集成电路管芯与外部互连件连接，形成具有集成电路管芯的器件空腔的第一封装，将器件腔中的器件安装在集成电路管芯上，并形成覆盖层 通过设备和第一次封装。