Invention Grant
US08115322B2 Adhesive, method of connecting wiring terminals and wiring structure
有权
粘接剂，接线端子连接方法及接线结构
- Patent Title: Adhesive, method of connecting wiring terminals and wiring structure
- Patent Title (中): 粘接剂，接线端子连接方法及接线结构
-
Application No.: US12874945Application Date: 2010-09-02
-
Publication No.: US08115322B2Publication Date: 2012-02-14
- Inventor: Motohiro Arifuku , Itsuo Watanabe , Kouji Motomura , Kouji Kobayashi , Yasushi Gotoh , Tohru Fujinawa
- Applicant: Motohiro Arifuku , Itsuo Watanabe , Kouji Motomura , Kouji Kobayashi , Yasushi Gotoh , Tohru Fujinawa
- Applicant Address: JP Tokyo
- Assignee: Hitachi Chemical Company, Ltd.
- Current Assignee: Hitachi Chemical Company, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JP11-238408 19990825
- Main IPC: C09J9/02
- IPC: C09J9/02 ; C09J4/06 ; H01B1/20 ; H05K3/36 ; H05K3/32 ; H01L21/60
Abstract:
This invention provides a wiring-terminal-connecting adhesive comprising a curing agent capable of generating a free radical upon heating, a radically polymerizable substance and silicone particles, and a wiring-terminal-connecting method and a wiring structure which make use of such an adhesive.
Public/Granted literature
- US20100330364A1 ADHESIVE, METHOD OF CONNECTING WIRING TERMINALS AND WIRING STRUCTURE Public/Granted day:2010-12-30
Information query
IPC分类:
