发明授权
US08116088B2 Semiconductor package and method of forming the same, and printed circuit board
有权
半导体封装及其形成方法,以及印刷电路板
- 专利标题: Semiconductor package and method of forming the same, and printed circuit board
- 专利标题(中): 半导体封装及其形成方法,以及印刷电路板
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申请号: US12116123申请日: 2008-05-06
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公开(公告)号: US08116088B2公开(公告)日: 2012-02-14
- 发明人: Mu-Seob Shin , Min-Young Son , Tae-Sung Yoon , Young-Hee Song , Byung-Seo Kim
- 申请人: Mu-Seob Shin , Min-Young Son , Tae-Sung Yoon , Young-Hee Song , Byung-Seo Kim
- 申请人地址: KR Gyeonggi-do
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: KR Gyeonggi-do
- 代理机构: Myers Bigel Sibley & Sajovec, P.A.
- 优先权: KR10-2007-0045012 20070509
- 主分类号: H05K1/11
- IPC分类号: H05K1/11 ; H05K3/34 ; H01L23/02 ; H01L23/48
摘要:
Provided are a semiconductor package, a method of forming the semiconductor package, and a printed circuit board (PCB). The semiconductor package includes: a PCB including at least two parts divided by an isolation region; a semiconductor chip mounted on the PCB; and a molding layer disposed in the isolation region. The method includes: preparing a PCB, the PCB including a plurality of chip regions and a scribe region; forming isolation regions dividing each of the chip regions into two parts, the isolation regions including inner isolation regions and outer isolation regions, the inner isolation regions being provided in the chip regions, the outer isolation regions being provided at both ends of the inner isolation regions so as to extend toward the scribe region; mounting semiconductor chips on the chip regions; and cutting the PCB along the scribe region to divide the chip regions into at least two parts.