发明授权
- 专利标题: Device having electronic components mounted therein and method for manufacturing such device
- 专利标题(中): 具有安装在其中的电子部件的装置及其制造方法
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申请号: US12669423申请日: 2008-07-18
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公开(公告)号: US08120921B2公开(公告)日: 2012-02-21
- 发明人: Takao Yamazaki , Shinji Watanabe , Tomoo Murakami , Yuuki Fujimura , Ryoji Osu , Katsuhiko Suzuki , Shizuaki Masuda , Nobuyuki Sato , Kikuo Wada
- 申请人: Takao Yamazaki , Shinji Watanabe , Tomoo Murakami , Yuuki Fujimura , Ryoji Osu , Katsuhiko Suzuki , Shizuaki Masuda , Nobuyuki Sato , Kikuo Wada
- 申请人地址: JP Tokyo JP Kakegawa
- 专利权人: NEC Corporation,NEC Access Technica, Ltd.
- 当前专利权人: NEC Corporation,NEC Access Technica, Ltd.
- 当前专利权人地址: JP Tokyo JP Kakegawa
- 代理机构: Sughrue Mion, PLLC
- 优先权: JP2007-188287 20070719
- 国际申请: PCT/JP2008/063007 WO 20080718
- 国际公布: WO2009/011419 WO 20090122
- 主分类号: H05K7/20
- IPC分类号: H05K7/20 ; H01L25/065
摘要:
A device having electronic components mounted therein has a first electronic component having an external terminal on a first surface and a heat spreader on a second surface, at least one second electronic component that is placed in the direction of a second surface of the first electronic component, a flexible circuit board that is electrically connected to the first electronic component and at least one second electronic component, and at least the part to which at least one second electronic component is connected is located on the second surface side of the first electronic component, and a spacer that is located between at least part of the flexible circuit board and the second surface of the first electronic component. The spacer can prevent heat from the first electronic component from being directly transferred to the second electronic component.
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