发明授权
- 专利标题： Substrate manufacturing method including protrusion removing step
- 专利标题（中）： 基板制造方法，包括突起去除工序
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申请号： US11997607申请日： 2006-07-27
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公开(公告)号： US08124000B2公开(公告)日： 2012-02-28
- 发明人: Susumu Tsujikawa , Yoshio Otani , Tetsumi Sumiyoshi
- 申请人： Susumu Tsujikawa , Yoshio Otani , Tetsumi Sumiyoshi
- 申请人地址： JP Tokyo
- 专利权人： Cyber Laser Inc.
- 当前专利权人： Cyber Laser Inc.
- 当前专利权人地址： JP Tokyo
- 代理机构： Pearne & Gordon LLP
- 优先权： JP2005-228948 20050805
- 国际申请： PCT/JP2006/314829 WO 20060727
- 国际公布： WO2007/018038 WO 20070215
- 主分类号： B23K26/36
- IPC分类号： B23K26/36 ; B29D11/00
摘要：
A method for removing and modifying a protrusion by using a short pulse laser is provided for modifying a color filter. In a color filter modifying method, a transparent substrate (2) is scanned with a beam in a parallel direction, while irradiating a protrusion (8) generated on the color filters (3-1, 3-2, 3-3) formed on a transparent substrate (2) with a beam collected by a high NA condensing lens (18), and a protrusion (8) is removed or modified.
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