Invention Grant
- Patent Title: Method for patterning a photosensitive layer
- Patent Title (中): 图案感光层的方法
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Application No.: US11861064Application Date: 2007-09-25
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Publication No.: US08124323B2Publication Date: 2012-02-28
- Inventor: Hsiao-Tzu Lu , Keui Shun Chen , Tsiao-Chen Wu , Vencent Chang , George Liu
- Applicant: Hsiao-Tzu Lu , Keui Shun Chen , Tsiao-Chen Wu , Vencent Chang , George Liu
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: G03F7/26
- IPC: G03F7/26

Abstract:
The method of patterning a photosensitive layer includes providing a substrate including a first layer formed thereon, treating the substrate including the first layer with cations, forming a first photosensitive layer over the first layer, patterning the first photosensitive layer to form a first pattern, treating the first pattern with cations, forming a second photosensitive layer over the treated first pattern, patterning the second photosensitive layer to form a second pattern, and processing the first layer using the first and second patterns as a mask.
Public/Granted literature
- US20090081591A1 METHOD FOR PATTERNING A PHOTOSENSITIVE LAYER Public/Granted day:2009-03-26
Information query
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