发明授权
- 专利标题： Method of forming an interconnect joint
- 专利标题（中）： 形成互连接头的方法
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申请号： US12837574申请日： 2010-07-16
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公开(公告)号： US08124517B2公开(公告)日： 2012-02-28
- 发明人: Lakshmi Supriya , Daewoong Suh
- 申请人： Lakshmi Supriya , Daewoong Suh
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 代理商 Kenneth A. Nelson
- 主分类号： H01L21/44
- IPC分类号： H01L21/44
摘要：
A method of forming an interconnect joint includes providing a first metal layer (210, 310), providing a film (220, 320) including metal particles (221, 321) and organic molecules (222, 322), placing the film over the first metal layer, placing a second metal layer (230, 330) over the film, and sintering the metal particles such that the organic molecules degrade and the first metal layer and the second metal layer are joined together.
公开/授权文献
- US20100276474A1 METHOD OF FORMING AN INTERCONNECT JOINT 公开/授权日：2010-11-04
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