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公开(公告)号：US20100276474A1
公开(公告)日：2010-11-04
申请号：US12837574
申请日：2010-07-16
申请人： Lakshmi Supriya , Daewoong Suh
发明人： Lakshmi Supriya , Daewoong Suh
CPC分类号： H05K3/321 , H01L24/29 , H01L24/83 , H01L2224/29 , H01L2224/29101 , H01L2224/292 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29364 , H01L2224/29369 , H01L2224/83801 , H01L2224/8384 , H01L2924/00013 , H01L2924/01006 , H01L2924/01018 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/351 , H05K3/102 , H05K2203/1131 , H05K2203/122 , Y10T428/12111 , Y10T428/24917 , Y10T428/25 , Y10T428/256 , H01L2924/00 , H01L2924/3512 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929
摘要： A method of forming an interconnect joint includes providing a first metal layer (210, 310), providing a film (220, 320) including metal particles (221, 321) and organic molecules (222, 322), placing the film over the first metal layer, placing a second metal layer (230, 330) over the film, and sintering the metal particles such that the organic molecules degrade and the first metal layer and the second metal layer are joined together.
摘要翻译： 形成互连接头的方法包括提供第一金属层（210,310），提供包括金属颗粒（221,321）和有机分子（222,322）的膜（220,320），将膜放置在第一 金属层，在膜上放置第二金属层（230,330），并烧结金属颗粒使得有机分子降解，并且第一金属层和第二金属层接合在一起。
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公开(公告)号：US08124517B2
公开(公告)日：2012-02-28
申请号：US12837574
申请日：2010-07-16
申请人： Lakshmi Supriya , Daewoong Suh
发明人： Lakshmi Supriya , Daewoong Suh
IPC分类号： H01L21/44
CPC分类号： H05K3/321 , H01L24/29 , H01L24/83 , H01L2224/29 , H01L2224/29101 , H01L2224/292 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29364 , H01L2224/29369 , H01L2224/83801 , H01L2224/8384 , H01L2924/00013 , H01L2924/01006 , H01L2924/01018 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/351 , H05K3/102 , H05K2203/1131 , H05K2203/122 , Y10T428/12111 , Y10T428/24917 , Y10T428/25 , Y10T428/256 , H01L2924/00 , H01L2924/3512 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929
摘要： A method of forming an interconnect joint includes providing a first metal layer (210, 310), providing a film (220, 320) including metal particles (221, 321) and organic molecules (222, 322), placing the film over the first metal layer, placing a second metal layer (230, 330) over the film, and sintering the metal particles such that the organic molecules degrade and the first metal layer and the second metal layer are joined together.
摘要翻译： 形成互连接头的方法包括提供第一金属层（210,310），提供包括金属颗粒（221,321）和有机分子（222,322）的膜（220,320），将膜放置在第一 金属层，在膜上放置第二金属层（230,330），并烧结金属颗粒使得有机分子降解，并且第一金属层和第二金属层接合在一起。
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公开(公告)号：US20080311738A1
公开(公告)日：2008-12-18
申请号：US11764247
申请日：2007-06-18
申请人： Lakshmi Supriya , Daewoong Suh
发明人： Lakshmi Supriya , Daewoong Suh
IPC分类号： H01L21/4763
CPC分类号： H05K3/321 , H01L24/29 , H01L24/83 , H01L2224/29 , H01L2224/29101 , H01L2224/292 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29364 , H01L2224/29369 , H01L2224/83801 , H01L2224/8384 , H01L2924/00013 , H01L2924/01006 , H01L2924/01018 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/351 , H05K3/102 , H05K2203/1131 , H05K2203/122 , Y10T428/12111 , Y10T428/24917 , Y10T428/25 , Y10T428/256 , H01L2924/00 , H01L2924/3512 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929
摘要： A method of forming an interconnect joint includes providing a first metal layer (210, 310), providing a film (220, 320) including metal particles (221, 321) and organic molecules (222, 322), placing the film over the first metal layer, placing a second metal layer (230, 330) over the film, and sintering the metal particles such that the organic molecules degrade and the first metal layer and the second metal layer are joined together.
摘要翻译： 形成互连接头的方法包括提供第一金属层（210,310），提供包括金属颗粒（221,321）和有机分子（222,322）的膜（220,320），将膜放置在第一 金属层，在膜上放置第二金属层（230,330），并烧结金属颗粒使得有机分子降解，并且第一金属层和第二金属层接合在一起。
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公开(公告)号：US07651021B2
公开(公告)日：2010-01-26
申请号：US11966943
申请日：2007-12-28
申请人： Lakshmi Supriya , Ravi Nalla
发明人： Lakshmi Supriya , Ravi Nalla
IPC分类号： B23K31/02
CPC分类号： B23K3/0623 , B23K2101/40 , H01L24/11 , H01L24/13 , H01L24/81 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2224/11005 , H01L2224/11009 , H01L2224/11334 , H01L2224/13111 , H01L2224/13155 , H01L2224/1316 , H01L2224/13186 , H01L2224/81011 , H01L2224/81191 , H01L2224/81192 , H01L2224/81801 , H01L2924/0001 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H05K1/111 , H05K3/3478 , H05K2201/0224 , H05K2201/083 , H05K2201/09036 , H05K2203/041 , H05K2203/0485 , H05K2203/0776 , H05K2203/104 , H05K2203/105 , H01L2924/05381 , H01L2924/01027 , H01L2224/13099 , H01L2224/05599
摘要： Electronic devices and methods for fabricating electronic devices are described. One method includes providing a substrate with a plurality of bonding pads thereon, and providing a plurality of solder microballs, the microballs including a coating thereon. The method also includes flowing the solder microballs onto the substrate and positioning the solder microballs on the bonding pads. The method also includes heating the solder microballs to reflow and form a joint between the solder microballs and the bonding pads. Other embodiments are described and claimed.
摘要翻译： 描述了用于制造电子设备的电子设备和方法。 一种方法包括在其上提供具有多个接合焊盘的基板，并且提供多个焊料微球，所述微球包括其上的涂层。 该方法还包括将焊料微球流到衬底上并将焊料微球定位在焊盘上。 该方法还包括加热焊料微球以回流并形成焊料微球和焊盘之间的接头。 描述和要求保护其他实施例。
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公开(公告)号：US20090169427A1
公开(公告)日：2009-07-02
申请号：US11966560
申请日：2007-12-28
CPC分类号： B01L3/502707 , B01J2219/00527 , B01J2219/00605 , B01J2219/00619 , B01L3/502715 , B01L2200/025 , B01L2200/027 , B01L2200/0605 , B01L2200/10 , B01L2300/046 , B01L2300/0627 , B01L2300/0816 , B01L2300/0819 , B01L2300/0822 , B01L2300/0867 , B01L2300/089 , B01L2300/16 , B01L2300/161 , B01L2300/165 , B01L2400/0406 , B01L2400/0688 , B05D3/12 , B05D5/00
摘要： A microelectronic package includes a die which may include MEMS and CMOS circuitry for analyzing a fluid. A defined path is provided for channeling fluid to the die. Rather than patterning depressions or physical channels in the package substrate, the defined paths comprise coatings that may channel the flow of liquids to the die for biological sensor type applications. The defined paths may comprise a wetting coating that has an affinity to fluids. Similarly, the defined paths may comprise a dewetting coating the tend to repel fluid surrounding the paths.
摘要翻译： 微电子封装包括可以包括用于分析流体的MEMS和CMOS电路的管芯。 提供了将流体引导到管芯的限定的路径。 定义的路径不是在封装衬底中图案化凹陷或物理通道，而是包括可以将液体流引导到用于生物传感器类型应用的管芯的涂层。 所定义的路径可以包括对流体具有亲和性的润湿涂层。 类似地，所定义的路径可以包括去潮涂层，其倾向于排斥路径周围的流体。
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公开(公告)号：US20090004841A1
公开(公告)日：2009-01-01
申请号：US11824212
申请日：2007-06-29
申请人： Lakshmi Supriya , Omar J. Bchir
发明人： Lakshmi Supriya , Omar J. Bchir
IPC分类号： H01L21/44
CPC分类号： H05K3/0017 , H01L21/486 , H01L21/76802 , H05K3/4644 , H05K2203/083 , H05K2203/1105 , H05K2203/308
摘要： In one embodiment, the present invention includes a method for forming a sacrificial material layer, patterning it to obtain a first patterned sacrificial material layer, embedding the first patterned sacrificial material layer into a dielectric material, treating the first patterned sacrificial material layer to remove it to thus provide a patterned dielectric layer having a plurality of openings in which vias may be formed. Other embodiments are described and claimed.
摘要翻译： 在一个实施例中，本发明包括一种形成牺牲材料层的方法，将其图形化以获得第一图案化牺牲材料层，将第一图案化牺牲材料层嵌入电介质材料中，处理第一图案化牺牲材料层以去除它 从而提供具有多个开口的图案化电介质层，其中可以形成通孔。 描述和要求保护其他实施例。
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公开(公告)号：US20130140014A1
公开(公告)日：2013-06-06
申请号：US13754071
申请日：2013-01-30
IPC分类号： F28F7/00
CPC分类号： F28F7/00 , H01L23/3735 , H01L23/3737 , H01L23/433 , H01L24/30 , H01L24/33 , H01L2224/73253 , H01L2924/01006 , H01L2924/01012 , H01L2924/01033 , H01L2924/01056 , Y10T156/10 , Y10T428/31663
摘要： Methods are disclosed to process a thermal interface material to achieve easy pick and placement of the thermal interface material without lowering thermal performance of a completed semiconductor package. One method involves applying a non-adhesive layer on one or more surfaces of the thermal interface material, interfacing the thermal interface material with one or more components to interface the non-adhesive layer therebetween, and applying heat to alter the non-adhesive layer to increase thermal contact between the thermal interface material and the interfacing component(s).
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8.发明申请MELTPROCESSED FLUOROPOLYMER ARTICLE AND METHOD FOR MELT-PROCESSING FLUOROPOLYMERS 有权熔融处理氟聚合物的熔融氟聚合物的方法和方法公开(公告)号：US20130085220A1
公开(公告)日：2013-04-04
申请号：US13631089
申请日：2012-09-28
IPC分类号： C08L27/18
摘要： A polymer article includes a meltproces sable blend of a melt-viscid fluoropolymer and a liquid crystalline polymer. Methods are presented for preparing a meltproces sable blend from a melt-viscid fluoropolymer and liquid crystalline polymer.
摘要翻译： 聚合物制品包括熔融粘稠的含氟聚合物和液晶聚合物的熔融混合物。 提出了从熔融粘稠的含氟聚合物和液晶聚合物制备熔融混合物的方法。
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9.发明授权Apparatus and methods of forming an interconnect between a workpiece and substrate 有权在工件和基板之间形成互连的装置和方法公开(公告)号：US08183697B2
公开(公告)日：2012-05-22
申请号：US12956141
申请日：2010-11-30
CPC分类号： H05K3/3489 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2224/11849 , H01L2224/13111 , H01L2224/29 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/29298 , H01L2224/731 , H01L2224/73104 , H01L2224/81011 , H01L2224/81193 , H01L2224/812 , H01L2224/81801 , H01L2224/83191 , H01L2224/83193 , H01L2224/83194 , H01L2224/9211 , H01L2924/00013 , H01L2924/00014 , H01L2924/01006 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/14 , H01L2924/15787 , H05K3/3436 , H05K2203/0113 , H01L2224/81 , H01L2224/83 , H01L2924/00 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2224/05599
摘要： Embodiments of an apparatus and methods of forming interconnect between a workpiece and substrate and its application to packaging of microelectronic devices are described herein. Other embodiments may be described and claimed.
摘要翻译： 本文描述了在工件和基板之间形成互连的装置和方法的实施例及其在微电子器件的封装中的应用。 可以描述和要求保护其他实施例。
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10.发明申请Apparatus And Methods Of Forming An Interconnect Between A Workpiece And Substrate 有权在工件和基板之间形成互连的装置和方法公开(公告)号：US20110074023A1
公开(公告)日：2011-03-31
申请号：US12956141
申请日：2010-11-30
CPC分类号： H05K3/3489 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2224/11849 , H01L2224/13111 , H01L2224/29 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/29298 , H01L2224/731 , H01L2224/73104 , H01L2224/81011 , H01L2224/81193 , H01L2224/812 , H01L2224/81801 , H01L2224/83191 , H01L2224/83193 , H01L2224/83194 , H01L2224/9211 , H01L2924/00013 , H01L2924/00014 , H01L2924/01006 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/14 , H01L2924/15787 , H05K3/3436 , H05K2203/0113 , H01L2224/81 , H01L2224/83 , H01L2924/00 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2224/05599
摘要： Embodiments of an apparatus and methods of forming interconnect between a workpiece and substrate and its application to packaging of microelectronic devices are described herein. Other embodiments may be described and claimed.
摘要翻译： 本文描述了在工件和基板之间形成互连的装置和方法的实施例及其在微电子器件的封装中的应用。 可以描述和要求保护其他实施例。
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