发明授权
US08125654B2 Methods and apparatus for measuring substrate edge thickness during polishing
有权
研磨过程中测量基材边缘厚度的方法和装置
- 专利标题： Methods and apparatus for measuring substrate edge thickness during polishing
- 专利标题（中）： 研磨过程中测量基材边缘厚度的方法和装置
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申请号： US12425017申请日： 2009-04-16
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公开(公告)号： US08125654B2公开(公告)日： 2012-02-28
- 发明人: Dominic J. Benvegnu , Boguslaw A. Swedek , Sen-Hou Ko , Abraham Ravid , Paul V. Miller
- 申请人： Dominic J. Benvegnu , Boguslaw A. Swedek , Sen-Hou Ko , Abraham Ravid , Paul V. Miller
- 申请人地址： US CA Santa Clara
- 专利权人： Applied Materials, Inc.
- 当前专利权人： Applied Materials, Inc.
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Dugan & Dugan, PC
- 主分类号： G01B11/28
- IPC分类号： G01B11/28
摘要：
Systems, methods and apparatus are provided for determining a substrate polishing endpoint. The invention includes a light source adapted to transmit light to an edge of a substrate; one or more detectors adapted to detect an arrangement of light reflected from the substrate edge; and a controller adapted to determine a polishing endpoint for the substrate edge based on the arrangement of reflected light. Numerous other aspects are provided.
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