Invention Grant
- Patent Title: Thermally expanded microspheres and a process for producing the same
- Patent Title (中): 热膨胀微球及其制备方法
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Application No.: US12066057Application Date: 2006-09-14
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Publication No.: US08129020B2Publication Date: 2012-03-06
- Inventor: Toshiaki Masuda , Ichiro Takahara , Kenichi Kitano , Katsushi Miki , Takeshi Inohara , Takayuki Aoki
- Applicant: Toshiaki Masuda , Ichiro Takahara , Kenichi Kitano , Katsushi Miki , Takeshi Inohara , Takayuki Aoki
- Applicant Address: JP Yao-Shi
- Assignee: Matsumoto Yushi-Seiyaku Co., Ltd.
- Current Assignee: Matsumoto Yushi-Seiyaku Co., Ltd.
- Current Assignee Address: JP Yao-Shi
- Agency: Global IP Counselors, LLP
- Priority: JP2005-303626 20050916
- International Application: PCT/JP2006/318261 WO 20060914
- International Announcement: WO2007/032436 WO 20070322
- Main IPC: C08J9/16
- IPC: C08J9/16 ; B32B1/00
Abstract:
Heat-expanded microspheres having high packing efficiency are produced by expanding heat-expandable microspheres, which include a shell of thermoplastic resin and a blowing agent encapsulated therein having a boiling point not higher than the softening point of the thermoplastic resin and have an average particle size from 1 to 100 micrometer, at a temperature not lower than their expansion initiating temperature, and the heat-expanded microspheres result in a void fraction not higher than 0.70.
Public/Granted literature
- US20090280328A1 THERMALLY EXPANDED MICROSPHERES AND A PROCESS FOR PRODUCING THE SAME Public/Granted day:2009-11-12
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