Invention Grant
- Patent Title: Light emitting diode package and method of making the same
- Patent Title (中): 发光二极管封装及其制作方法
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Application No.: US12481549Application Date: 2009-06-09
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Publication No.: US08129206B2Publication Date: 2012-03-06
- Inventor: Hung-Yi Lin , Kuan-Jui Huang , Yen-Ting Kung , She-Fen Tien
- Applicant: Hung-Yi Lin , Kuan-Jui Huang , Yen-Ting Kung , She-Fen Tien
- Applicant Address: TW Taoyuan Hsien
- Assignee: Touch Micro-System Technology Corp.
- Current Assignee: Touch Micro-System Technology Corp.
- Current Assignee Address: TW Taoyuan Hsien
- Agency: Chen Yoshimura LLP
- Priority: TW97139170A 20081013
- Main IPC: H01L33/00
- IPC: H01L33/00
Abstract:
The light emitting diode package of the present invention uses photosensitive materials to form phosphor encapsulations or a phosphor layer, which can be fabricated by means of semiconductor processes in batch. Also, the concentration of phosphors in individual regions can be accurately and easily controlled by a laser printing process or by light-through holes. Accordingly, the optic effects of light emitting diode packages can be accurately adjusted.
Public/Granted literature
- US20100090245A1 LIGHT EMITTING DIODE PACKAGE AND METHOD OF MAKING THE SAME Public/Granted day:2010-04-15
Information query
IPC分类:
