An apparatus for inspecting solder printing includes a memory medium, an ideal solder information generation unit, and an image processing unit. Design data are stored in the memory medium. The ideal solder information generation unit generates “ideal solder position information” and “ideal solder sizes” from the ideal solder regions in the design data. The image processing means extracts the actual solder regions of solder on the printed board K from image data imaged by the CCD camera and generates “actual solder position information” from the actual solder regions. The image processing unit generates “position misalignment amounts” between the “ideal solder position information” and “actual solder position information,” generates “print misalignment rates” indicating the extents of the “position misalignment amounts” relative to the “ideal solder sizes,” calculates a correction value relating to print position based on the “print misalignment rates,” and outputs a correction value signal to the solder printing machine.