发明授权
US08133758B2 Method of fabricating phase-change memory device having TiC layer
有权
具有TiC层的相变存储器件的制造方法
- 专利标题: Method of fabricating phase-change memory device having TiC layer
- 专利标题(中): 具有TiC层的相变存储器件的制造方法
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申请号: US12623513申请日: 2009-11-23
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公开(公告)号: US08133758B2公开(公告)日: 2012-03-13
- 发明人: Gyu-Hwan Oh , Young-Lim Park , Soon-Oh Park , Jin-Il Lee , Chang-Su Kim
- 申请人: Gyu-Hwan Oh , Young-Lim Park , Soon-Oh Park , Jin-Il Lee , Chang-Su Kim
- 申请人地址: KR Suwon-Si, Gyeonggi-Do
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: KR Suwon-Si, Gyeonggi-Do
- 代理机构: Volentine & Whitt, PLLC
- 优先权: KR10-2009-0006293 20090123
- 主分类号: H01L21/00
- IPC分类号: H01L21/00
摘要:
Provided is a method of fabricating a phase-change memory device. The phase-change memory device includes a memory cell having a switching device and a phase change pattern. The method includes; forming a TiC layer on a contact electrically connecting the switching device using a plasma enhanced cyclic chemical vapor deposition (PE-cyclic CVD) process, patterning the TiC layer to form a lower electrode on the contact, and forming the phase-change pattern on the lower electrode.
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