Invention Grant
- Patent Title: Method of forming electronic material layer and method of manufacturing electronic device using the method of forming electronic material layer
- Patent Title (中): 电子材料层的形成方法以及使用形成电子材料层的方法制造电子器件的方法
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Application No.: US12700488Application Date: 2010-02-04
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Publication No.: US08137740B2Publication Date: 2012-03-20
- Inventor: Cheol Jin Lee , Sun Kug Kim
- Applicant: Cheol Jin Lee , Sun Kug Kim
- Applicant Address: KR Seongbuk-Gu, Seoul
- Assignee: Korean University Research and Business Foundation
- Current Assignee: Korean University Research and Business Foundation
- Current Assignee Address: KR Seongbuk-Gu, Seoul
- Agency: Buchanan Ingersoll & Rooney PC
- Priority: KR10-2009-0020728 20090311
- Main IPC: B05D5/12
- IPC: B05D5/12

Abstract:
A method of transferring an electronic material and a method of manufacturing an electronic device using the method of transferring the electronic material. The method of transferring the electronic material includes dipping a template, on which an electronic material layer is formed, into a liquid medium, separating the electronic material layer from the template, and floating the electronic material layer on a surface of the liquid medium; raising up the electronic material layer floated on the surface of the liquid medium by using a target substrate and transferring the electronic material layer on the target substrate; and fixing the electronic material layer to the target substrate.
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