发明授权
- 专利标题: Semiconductor device manufacturing method
- 专利标题(中): 半导体器件制造方法
-
申请号: US12564440申请日: 2009-09-22
-
公开(公告)号: US08138059B2公开(公告)日: 2012-03-20
- 发明人: Kentaro Matsunaga , Hirokazu Kato , Tomoya Oori
- 申请人: Kentaro Matsunaga , Hirokazu Kato , Tomoya Oori
- 申请人地址: JP Tokyo
- 专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人地址: JP Tokyo
- 代理机构: Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- 优先权: JP2008-290744 20081113
- 主分类号: H01L21/76
- IPC分类号: H01L21/76
摘要:
A semiconductor device manufacturing method includes: forming a core pattern on a foundation film, the core pattern containing a material generating acid by light exposure; selectively exposing part of the core pattern except an longitudinal end portion; supplying a mask material onto the foundation film so as to cover the core pattern, the mask material being crosslinkable upon supply acid from the core pattern; etching back the mask material to expose an upper surface of the core pattern and remove a portion of the mask material formed on the end portion of the core pattern, thereby leaving a mask material side wall portion formed on a side wall of the core pattern; and removing the core pattern and processing the foundation film by using the mask material sidewall portion left on the foundation film as a mask.
公开/授权文献
- US20100120255A1 SEMICONDUCTOR DEVICE MANUFACTURING METHOD 公开/授权日:2010-05-13
信息查询
IPC分类: