发明授权
US08141769B2 Process for repairing a component comprising a directional microstructure by setting a temperature gradient during the laser heat action, and a component produced by such a process
失效
通过在激光加热动作期间设定温度梯度来修复包括定向微结构的部件的工艺，以及通过这种工艺制造的部件
- 专利标题： Process for repairing a component comprising a directional microstructure by setting a temperature gradient during the laser heat action, and a component produced by such a process
- 专利标题（中）： 通过在激光加热动作期间设定温度梯度来修复包括定向微结构的部件的工艺，以及通过这种工艺制造的部件
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申请号： US11989214申请日： 2005-07-22
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公开(公告)号： US08141769B2公开(公告)日： 2012-03-27
- 发明人: Michael Ott , Uwe Paul , Robert Singer , Andreas Volek
- 申请人： Michael Ott , Uwe Paul , Robert Singer , Andreas Volek
- 申请人地址： DE Munich
- 专利权人： Siemens Aktiengesellschaft
- 当前专利权人： Siemens Aktiengesellschaft
- 当前专利权人地址： DE Munich
- 国际申请： PCT/EP2005/008038 WO 20050722
- 国际公布： WO2007/012338 WO 20070201
- 主分类号： B23K26/34
- IPC分类号： B23K26/34 ; B23K31/02
摘要：
In one aspect, a repair method for repairing components comprising a base material with a directed microstructure is provided. The repair is performed in such a way that the repaired location correspondingly has a directed microstructure like the surrounding base material. A solder is applied in the region of a location to be repaired and is soldered to the component via heat exposure, a temperature gradient, i.e., for instance a temperature variation from a higher temperature to a lower temperature, is thereby produced in the region of the location to be repaired.