Method for Repairing Cracks in Components and Solder Material for Soldering Components
    10.
    发明申请
    Method for Repairing Cracks in Components and Solder Material for Soldering Components 有权
    焊接部件组件和焊料的裂纹修复方法

    公开(公告)号:US20090283572A1

    公开(公告)日:2009-11-19

    申请号:US12085277

    申请日:2006-10-31

    申请人: Andreas Volek

    发明人: Andreas Volek

    IPC分类号: B23K31/02 B23K35/24

    摘要: The invention relates to a method for repairing components that consist of superalloys, in particular for repairing components that consist of a superalloy with an aligned microstructure in such a way that the repaired site likewise has an aligned microstructure. The method comprises the following steps: a solder material is applied to the repair site; the repair site with the applied solder material is heated until the latter melts; and the melted solder material is left to solidify. The solder material is an alloy with the same alloy components as the component alloy. At least the fraction of one alloy component in the solder material composition is modified in relation to the fraction of that alloy component in the component alloy composition, in such a way that the melting temperature of the solder material is reduced in relation to the melting temperature of the component alloy.

    摘要翻译: 本发明涉及一种用于修复由超级合金组成的部件的方法,特别是用于修补由具有对准的微结构的超级合金组成的部件,使得修复的部位同样具有对准的微观结构。 该方法包括以下步骤:将焊料材料施加到修复部位; 使用所施加的焊料材料的修复部位加热直到熔化; 并使熔化的焊料材料固化。 焊料材料是与组分合金具有相同合金成分的合金。 焊料材料组合物中的一种合金组分的至少一部分相对于组分合金组合物中该合金组分的分数进行改性,使得焊料材料的熔融温度相对于熔融温度降低 的组分合金。