Invention Grant
- Patent Title: Inspecting method and inspecting apparatus for substrate surface
- Patent Title (中): 基板表面检查方法及检查装置
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Application No.: US12470505Application Date: 2009-05-22
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Publication No.: US08144337B2Publication Date: 2012-03-27
- Inventor: Akira Hamamatsu , Yoshimasa Oshima , Shunji Maeda , Hisae Shibuya , Yuta Urano , Toshiyuki Nakao , Shigenobu Maruyama
- Applicant: Akira Hamamatsu , Yoshimasa Oshima , Shunji Maeda , Hisae Shibuya , Yuta Urano , Toshiyuki Nakao , Shigenobu Maruyama
- Applicant Address: JP Tokyo
- Assignee: Hitachi High-Technologies Corporation
- Current Assignee: Hitachi High-Technologies Corporation
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JP2008-134945 20080523; JP2008-263397 20081010
- Main IPC: G01B11/30
- IPC: G01B11/30
Abstract:
To inspect a substrate such as a semiconductor substrate for surface roughness at high precision.The surface roughness of the substrate is measured in each frequency band of the surface roughness by applying a light to the substrate surface and detecting a scattered light or reflected light at a plurality of azimuth or elevation angles.
Public/Granted literature
- US20090290168A1 Inspecting Method and Inspecting Apparatus for Substrate Surface Public/Granted day:2009-11-26
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