Invention Grant
- Patent Title: Diaphragm structure and MEMS device
- Patent Title (中): 隔膜结构和MEMS器件
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Application No.: US12630179Application Date: 2009-12-03
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Publication No.: US08146437B2Publication Date: 2012-04-03
- Inventor: Yuichi Miyoshi , Yusuke Takeuchi , Tohru Yamaoka , Hiroshi Ogura
- Applicant: Yuichi Miyoshi , Yusuke Takeuchi , Tohru Yamaoka , Hiroshi Ogura
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2007-164647 20070622
- Main IPC: G01L9/06
- IPC: G01L9/06
Abstract:
A diaphragm structure for a MEMS device includes a through-hole formed so as to penetrate from an upper surface to a bottom surface of a substrate; and a vibrating electrode film formed on the upper surface of the substrate so as to cover the through-hole. An opening shape of the through-hole in the upper surface of the substrate is substantially hexagonal.
Public/Granted literature
- US20100077863A1 DIAPHRAGM STRUCTURE AND MEMS DEVICE Public/Granted day:2010-04-01
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