发明授权
- 专利标题： Image sensing devices and methods for fabricating the same
- 专利标题（中）： 图像感测装置及其制造方法
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申请号： US12407115申请日： 2009-03-19
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公开(公告)号： US08153458B2公开(公告)日： 2012-04-10
- 发明人: Jui-Ping Weng , Tzu-Han Lin , Pai-Chun Peter Zung
- 申请人： Jui-Ping Weng , Tzu-Han Lin , Pai-Chun Peter Zung
- 申请人地址： TW Hsinchu
- 专利权人： Visera Technologies Company Limited
- 当前专利权人： Visera Technologies Company Limited
- 当前专利权人地址： TW Hsinchu
- 代理机构： Thomas|Kayden
- 主分类号： H01L21/70
- IPC分类号： H01L21/70 ; H01L31/0232 ; H01L31/14
摘要：
Image sensing devices and methods for fabricating the same are provided. An exemplary image sensing device comprises a first substrate having a first side and a second side opposing each other. A plurality of image sensing elements is formed in the first substrate at the first side. A conductive via is formed through the first substrate, having a first surface exposed by the first substrate at the first side and a second surface exposed by the first substrate at the second side. A conductive pad overlies the conductive via at the first side and is electrically connecting the image sensing elements. A conductive layer overlies the conductive via at the second side and electrically connects with the conductive pad. A conductive bump is formed over a portion of the conductive layer. A second substrate is bonded with the first substrate at the first side.
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