发明授权
- 专利标题: Multi-component strain-inducing semiconductor regions
- 专利标题(中): 多组分应变诱导半导体区域
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申请号: US13107739申请日: 2011-05-13
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公开(公告)号: US08154087B2公开(公告)日: 2012-04-10
- 发明人: Ted E. Cook, Jr. , Bernhard Sell , Anand Murthy
- 申请人: Ted E. Cook, Jr. , Bernhard Sell , Anand Murthy
- 申请人地址: US CA Santa Clara
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Blakely, Sokoloff, Taylor & Zafman LLP
- 主分类号: H01L27/088
- IPC分类号: H01L27/088
摘要:
A multi-component strain-inducing semiconductor region is described. In an embodiment, formation of such a strain-inducing semiconductor region laterally adjacent to a crystalline substrate results in a uniaxial strain imparted to the crystalline substrate, providing a strained crystalline substrate. In one embodiment, the multi-component strain-inducing material region comprises a first portion and a second portion which are separated by an interface. In a specific embodiment, the concentration of charge-carrier dopant impurity atoms of the two portions are different from one another at the interface.
公开/授权文献
- US20110215375A1 MULTI-COMPONENT STRAIN-INDUCING SEMICONDUCTOR REGIONS 公开/授权日:2011-09-08
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