发明授权
US08154115B1 Package structure having MEMS element and fabrication method thereof
有权
具有MEMS元件的封装结构及其制造方法
- 专利标题: Package structure having MEMS element and fabrication method thereof
- 专利标题(中): 具有MEMS元件的封装结构及其制造方法
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申请号: US13024672申请日: 2011-02-10
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公开(公告)号: US08154115B1公开(公告)日: 2012-04-10
- 发明人: Chang-Yueh Chan , Chien-Ping Huang , Chun-Chi Ke , Shih-Kuang Chiu
- 申请人: Chang-Yueh Chan , Chien-Ping Huang , Chun-Chi Ke , Shih-Kuang Chiu
- 申请人地址: TW Taichung
- 专利权人: Siliconware Precision Industries Co., Ltd.
- 当前专利权人: Siliconware Precision Industries Co., Ltd.
- 当前专利权人地址: TW Taichung
- 代理机构: Edwards Wildman Palmer LLP
- 代理商 Peter F. Corless; Steven M. Jensen
- 优先权: TW99144690A 20101217
- 主分类号: H01L23/12
- IPC分类号: H01L23/12
摘要:
A package structure having an MEMS element includes: a chip having at least an MEMS element and a plurality of first conductive pads; a lid disposed on the chip to cover the MEMS element and having a plurality of second conductive pads formed thereon; a plurality of bonding wires electrically connecting the first and second conductive pads; a plurality of first bumps disposed on the second conductive pads, respectively; an encapsulant formed on the chip to encapsulate the lid, the bonding wires, the first and second conductive pads and the first bumps while exposing the top surfaces of the first bumps; and a plurality of circuits formed on the encapsulant and electrically connecting to the exposed first bumps, thereby avoiding the conventional drawback of electrical connection failure caused by position deviation of bonding wires due to mold flow of the encapsulant.