Invention Grant
US08163602B2 Ultraviolet energy curable tape and method of making a semiconductor chip using the tape
有权
紫外线固化胶带和使用胶带制造半导体芯片的方法
- Patent Title: Ultraviolet energy curable tape and method of making a semiconductor chip using the tape
- Patent Title (中): 紫外线固化胶带和使用胶带制造半导体芯片的方法
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Application No.: US13011509Application Date: 2011-01-21
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Publication No.: US08163602B2Publication Date: 2012-04-24
- Inventor: Timothy C. Krywanczyk , Donald W. Brouillette , Steven A. Martel , Matthew R. Whalen
- Applicant: Timothy C. Krywanczyk , Donald W. Brouillette , Steven A. Martel , Matthew R. Whalen
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent Joseph Petrokaitis, Esq.
- Main IPC: H01L21/44
- IPC: H01L21/44
Abstract:
There is provided a UV energy curable tape comprising an adhesive material including a UV energy curable oligomer, a UV energy initiator, and a material which emits optical light when the tape composition is substantially fully cured. A semiconductor chip made using the tape is also provided.
Public/Granted literature
- US20110115072A1 ULTRAVIOLET ENERGY CURABLE TAPE AND METHOD OF MAKING A SEMICONDUCTOR CHIP USING THE TAPE Public/Granted day:2011-05-19
Information query
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