发明授权
- 专利标题： Cooling devices in semiconductor packages
- 专利标题（中）： 半导体封装中的冷却装置
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申请号： US12917157申请日： 2010-11-01
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公开(公告)号： US08164169B2公开(公告)日： 2012-04-24
- 发明人: Gregory M. Chrysler , Tony A. Opheim
- 申请人： Gregory M. Chrysler , Tony A. Opheim
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 代理商 John N. Greaves
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
An embodiment of the present invention is a technique to fabricate a cover assembly. A cover has a base plate and sidewalls attached to perimeter of the base plate. The sidewalls have a height. A plurality of devices is attached to underside of the base plate. The devices have length corresponding to the height such that the devices are sealed within the cover when the cover is attached to a surface.
公开/授权文献
- US20110135015A1 COOLING DEVICES IN SEMICONDUCTOR PACKAGES 公开/授权日：2011-06-09
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