Invention Grant
- Patent Title: Method of making a circuit structure of a circuit board
- Patent Title (中): 制作电路板电路结构的方法
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Application No.: US12270718Application Date: 2008-11-13
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Publication No.: US08166652B2Publication Date: 2012-05-01
- Inventor: Cheng-Po Yu
- Applicant: Cheng-Po Yu
- Applicant Address: TW Taoyuan
- Assignee: Unimicron Technology Corp.
- Current Assignee: Unimicron Technology Corp.
- Current Assignee Address: TW Taoyuan
- Agency: J.C. Patents
- Priority: TW97134205A 20080905
- Main IPC: H05K3/10
- IPC: H05K3/10

Abstract:
A circuit structure of a circuit board includes a dielectric layer, a number of first circuits, and a number of second circuits. The dielectric layer has a surface and an intaglio pattern. The first circuits are disposed on the surface of the dielectric layer. The second circuits are disposed in the intaglio pattern of the dielectric layer. Line widths of the second circuits are smaller than line widths of the first circuits, and a distance between every two of the adjacent second circuits is shorter than a distance between every two of the adjacent first circuits.
Public/Granted literature
- US20100059256A1 CIRCUIT STRUCTURE OF CIRCUIT BOARD AND PROCESS FOR MANUFACTURING THE SAME Public/Granted day:2010-03-11
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