Invention Grant
- Patent Title: Die cushion device
- Patent Title (中): 模具缓冲装置
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Application No.: US11794965Application Date: 2006-01-12
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Publication No.: US08166791B2Publication Date: 2012-05-01
- Inventor: Kiyokazu Baba , Hiroaki Honma , Masahide Sunata , Hajime Yoshida , Hirohide Satou
- Applicant: Kiyokazu Baba , Hiroaki Honma , Masahide Sunata , Hajime Yoshida , Hirohide Satou
- Applicant Address: JP Tokyo JP Tokyo JP Toyota-shi
- Assignee: Komatsu Ltd,Komatsu Industries Corp.,Toyota Jidosha Kabushiki Kaisha
- Current Assignee: Komatsu Ltd,Komatsu Industries Corp.,Toyota Jidosha Kabushiki Kaisha
- Current Assignee Address: JP Tokyo JP Tokyo JP Toyota-shi
- Agency: Holtz, Holtz, Goodman & Chick, PC
- Priority: JP2005-007800 20050114
- International Application: PCT/JP2006/300290 WO 20060112
- International Announcement: WO2006/075660 WO 20060720
- Main IPC: B21D22/00
- IPC: B21D22/00 ; B21J9/18 ; B30B13/00 ; B30B1/32

Abstract:
A die cushion pad 13 is divided into four small pads 15 and a large pad 16. With this arrangement, a load applied to an action point of each of the small pads 15 can be equalized by the large pad 16, and an overturning moment arising between the action point and a reaction force point that equates the center of the small pad 15 can be canceled, thereby preventing flexure of the small pad 15. Accordingly, since flexure of the cushion pin and the like can be prevented, there is no risk that the cushion pin is frictioned against the penetrating hole of a bolster, and the lifting operation can be smoothly performed, whereby a higher-accuracy pressing forming operation can be realized.
Public/Granted literature
- US20080127838A1 Die Cushion Device Public/Granted day:2008-06-05
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