Invention Grant
- Patent Title: Film-forming apparatus and film-forming method
- Patent Title (中): 成膜装置及成膜方法
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Application No.: US10417139Application Date: 2003-04-17
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Publication No.: US08168001B2Publication Date: 2012-05-01
- Inventor: Hiroto Uchida , Takehito Jinbo , Takeshi Masuda , Masahiko Kajinuma , Takakazu Yamada , Masaki Uematsu , Koukou Suu , Isao Kimura
- Applicant: Hiroto Uchida , Takehito Jinbo , Takeshi Masuda , Masahiko Kajinuma , Takakazu Yamada , Masaki Uematsu , Koukou Suu , Isao Kimura
- Applicant Address: JP Kanagawa
- Assignee: Ulvac, Inc.
- Current Assignee: Ulvac, Inc.
- Current Assignee Address: JP Kanagawa
- Agency: Arent Fox LLP
- Priority: JP2002-117123 20020419; JP2002-243507 20020823
- Main IPC: C23C16/00
- IPC: C23C16/00 ; C23C16/455 ; H01L21/306

Abstract:
Film-forming apparatus including a film-forming vacuum chamber having a stage for a substrate, a chamber for mixing gas comprising a raw gas and a reactive gas connected to the film-forming chamber, a chamber for vaporizing the raw material, and a gas head for introducing the mixed gas into the film-forming chamber, disposed on the upper face of the film-forming chamber and opposed to the stage. Particle traps with controllable temperatures are positioned between the vaporization chamber and the mixing chamber and on the downstream side of the mixing chamber. When forming a thin film with the apparatus, a reactive gas and/or a carrier gas are passed through the film-forming chamber while opening a valve in a by-pass line, connecting the primary side to the secondary side of the particle trap arranged at the downstream side of the mixing chamber. The valve is then closed and the film-forming operation is initiated.
Public/Granted literature
- US20030198741A1 Film-forming apparatus and film-forming method Public/Granted day:2003-10-23
Information query
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