发明授权
- 专利标题: Light emitting diode package and fabrication method thereof
- 专利标题(中): 发光二极管封装及其制造方法
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申请号: US12370802申请日: 2009-02-13
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公开(公告)号: US08168453B2公开(公告)日: 2012-05-01
- 发明人: Kyung Taeg Han , In Tae Yeo , Hun Joo Hahm , Chang Ho Song , Seong Yeon Han , Yoon Sung Na , Dae Yeon Kim , Ho Sik Ahn , Young Sam Park
- 申请人: Kyung Taeg Han , In Tae Yeo , Hun Joo Hahm , Chang Ho Song , Seong Yeon Han , Yoon Sung Na , Dae Yeon Kim , Ho Sik Ahn , Young Sam Park
- 申请人地址: KR Gyunggi-do
- 专利权人: Samsung LED Co., Ltd.
- 当前专利权人: Samsung LED Co., Ltd.
- 当前专利权人地址: KR Gyunggi-do
- 代理机构: McDermott Will & Emery LLP
- 优先权: KR10-2006-0034706 20060417
- 主分类号: H01L21/56
- IPC分类号: H01L21/56
摘要:
An LED package and a fabrication method therefor. The LED package includes first and second lead frames made of heat and electric conductors, each of the lead frames comprising a planar base and extensions extending in opposed directions and upward directions from the base. The package also includes a package body made of a resin and configured to surround the extensions of the first and second lead frames to fix the first and second lead frames while exposing underside surfaces of the first and second lead frames. The LED package further includes a light emitting diode chip disposed on an upper surface of the base of the first lead frame and electrically connected to the bases of the first and second lead frames, and a transparent encapsulant for encapsulating the light emitting diode chip.
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