发明授权
- 专利标题： On-chip embedded thermal antenna for chip cooling
- 专利标题（中）： 片上嵌入式热天线芯片散热
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申请号： US13244998申请日： 2011-09-26
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公开(公告)号： US08178434B2公开(公告)日： 2012-05-15
- 发明人: Fen Chen , Jeffrey P. Gambino , Alvin W. Strong
- 申请人： Fen Chen , Jeffrey P. Gambino , Alvin W. Strong
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 代理机构： Gibb I.P. Law Firm, LLC
- 代理商 Richard M. Kotulak, Esq.
- 主分类号： H01L21/768
- IPC分类号： H01L21/768
摘要：
An apparatus comprises a first layer within a semiconductor chip having active structures electrically connected to other active structures and having electrically isolated first inactive structures. A second layer within the semiconductor chip is physically connected to the first layer. The second layer comprises an insulator and has second inactive structures. The first inactive structures are physically aligned with the second inactive structures.
公开/授权文献
- US20120015511A1 ON-CHIP EMBEDDED THERMAL ANTENNA FOR CHIP COOLING 公开/授权日：2012-01-19
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