Invention Grant
- Patent Title: Apparatus and methods of forming an interconnect between a workpiece and substrate
- Patent Title (中): 在工件和基板之间形成互连的装置和方法
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Application No.: US12956141Application Date: 2010-11-30
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Publication No.: US08183697B2Publication Date: 2012-05-22
- Inventor: Lakshmi Supriya , Anna M. Prakash , Tommy Ashton, II
- Applicant: Lakshmi Supriya , Anna M. Prakash , Tommy Ashton, II
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agent Kenneth A. Nelson
- Main IPC: H01L29/40
- IPC: H01L29/40 ; H01L21/44
Abstract:
Embodiments of an apparatus and methods of forming interconnect between a workpiece and substrate and its application to packaging of microelectronic devices are described herein. Other embodiments may be described and claimed.
Public/Granted literature
- US20110074023A1 Apparatus And Methods Of Forming An Interconnect Between A Workpiece And Substrate Public/Granted day:2011-03-31
Information query
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