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1.发明授权Apparatus and methods of forming an interconnect between a workpiece and substrate 有权在工件和基板之间形成互连的装置和方法公开(公告)号：US08183697B2
公开(公告)日：2012-05-22
申请号：US12956141
申请日：2010-11-30
CPC分类号： H05K3/3489 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2224/11849 , H01L2224/13111 , H01L2224/29 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/29298 , H01L2224/731 , H01L2224/73104 , H01L2224/81011 , H01L2224/81193 , H01L2224/812 , H01L2224/81801 , H01L2224/83191 , H01L2224/83193 , H01L2224/83194 , H01L2224/9211 , H01L2924/00013 , H01L2924/00014 , H01L2924/01006 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/14 , H01L2924/15787 , H05K3/3436 , H05K2203/0113 , H01L2224/81 , H01L2224/83 , H01L2924/00 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2224/05599
摘要： Embodiments of an apparatus and methods of forming interconnect between a workpiece and substrate and its application to packaging of microelectronic devices are described herein. Other embodiments may be described and claimed.
摘要翻译： 本文描述了在工件和基板之间形成互连的装置和方法的实施例及其在微电子器件的封装中的应用。 可以描述和要求保护其他实施例。
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2.发明授权Apparatus and methods of forming an interconnect between a workpiece and substrate 有权在工件和基板之间形成互连的装置和方法公开(公告)号：US07843075B2
公开(公告)日：2010-11-30
申请号：US12151063
申请日：2008-05-01
CPC分类号： H05K3/3489 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2224/11849 , H01L2224/13111 , H01L2224/29 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/29298 , H01L2224/731 , H01L2224/73104 , H01L2224/81011 , H01L2224/81193 , H01L2224/812 , H01L2224/81801 , H01L2224/83191 , H01L2224/83193 , H01L2224/83194 , H01L2224/9211 , H01L2924/00013 , H01L2924/00014 , H01L2924/01006 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/14 , H01L2924/15787 , H05K3/3436 , H05K2203/0113 , H01L2224/81 , H01L2224/83 , H01L2924/00 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2224/05599
摘要： Embodiments of an apparatus and methods of forming interconnect between a workpiece and substrate and its application to packaging of microelectronic devices are described herein. Other embodiments may be described and claimed.
摘要翻译： 本文描述了在工件和基板之间形成互连的装置和方法的实施例及其在微电子器件的封装中的应用。 可以描述和要求保护其他实施例。
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3.发明申请Apparatus And Methods Of Forming An Interconnect Between A Workpiece And Substrate 有权在工件和基板之间形成互连的装置和方法公开(公告)号：US20110074023A1
公开(公告)日：2011-03-31
申请号：US12956141
申请日：2010-11-30
CPC分类号： H05K3/3489 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2224/11849 , H01L2224/13111 , H01L2224/29 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/29298 , H01L2224/731 , H01L2224/73104 , H01L2224/81011 , H01L2224/81193 , H01L2224/812 , H01L2224/81801 , H01L2224/83191 , H01L2224/83193 , H01L2224/83194 , H01L2224/9211 , H01L2924/00013 , H01L2924/00014 , H01L2924/01006 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/14 , H01L2924/15787 , H05K3/3436 , H05K2203/0113 , H01L2224/81 , H01L2224/83 , H01L2924/00 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2224/05599
摘要： Embodiments of an apparatus and methods of forming interconnect between a workpiece and substrate and its application to packaging of microelectronic devices are described herein. Other embodiments may be described and claimed.
摘要翻译： 本文描述了在工件和基板之间形成互连的装置和方法的实施例及其在微电子器件的封装中的应用。 可以描述和要求保护其他实施例。
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4.发明申请Apparatus and methods of forming an interconnect between a workpiece and substrate 有权在工件和基板之间形成互连的装置和方法公开(公告)号：US20090273914A1
公开(公告)日：2009-11-05
申请号：US12151063
申请日：2008-05-01
IPC分类号： H01L21/768 , H01L21/50 , H05K7/00
CPC分类号： H05K3/3489 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2224/11849 , H01L2224/13111 , H01L2224/29 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/29298 , H01L2224/731 , H01L2224/73104 , H01L2224/81011 , H01L2224/81193 , H01L2224/812 , H01L2224/81801 , H01L2224/83191 , H01L2224/83193 , H01L2224/83194 , H01L2224/9211 , H01L2924/00013 , H01L2924/00014 , H01L2924/01006 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/14 , H01L2924/15787 , H05K3/3436 , H05K2203/0113 , H01L2224/81 , H01L2224/83 , H01L2924/00 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2224/05599
摘要： Embodiments of an apparatus and methods of forming interconnect between a workpiece and substrate and its application to packaging of microelectronic devices are described herein. Other embodiments may be described and claimed.
摘要翻译： 本文描述了在工件和基板之间形成互连的装置和方法的实施例及其在微电子器件的封装中的应用。 可以描述和要求保护其他实施例。
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公开(公告)号：US20070284412A1
公开(公告)日：2007-12-13
申请号：US11444738
申请日：2006-05-31
IPC分类号： A47J36/02
CPC分类号： B23K35/3618 , H05K3/3489
摘要： A composition, a method, and a system for a solder flux are disclosed herein. In various embodiments, a solder flux composition may comprise a surfactant and less than about 20% of a carboxylic acid. In some of these embodiments, the solder flux composition may be used in lead-free soldering processes.
摘要翻译： 本文公开了焊剂的组成，方法和系统。 在各种实施方案中，助焊剂组合物可以包含表面活性剂和小于约20％的羧酸。 在这些实施例的一些中，焊剂组合物可以用于无铅焊接工艺中。
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6.发明授权Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing same 有权具有用于体偏置的电介质障碍物的芯片封装热界面材料，其使用方法以及含有它们的体系公开(公告)号：US07776657B2
公开(公告)日：2010-08-17
申请号：US11935597
申请日：2007-11-06
IPC分类号： H01L21/00
CPC分类号： H01L23/3737 , H01L2224/05571 , H01L2224/05573 , H01L2224/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/2929 , H01L2224/293 , H01L2224/29486 , H01L2224/2949 , H01L2224/29499 , H01L2224/32245 , H01L2224/73253 , H01L2924/00014 , H01L2924/01079 , H01L2924/01327 , H01L2924/15311 , H01L2924/16152 , H01L2924/00 , H01L2224/05599
摘要： A chip package includes a thermal interface material disposed between a die backside and a heat sink. The thermal interface material includes a first metal particle that is covered by a dielectric film. The dielectric film is selected from an inorganic compound of the first metal or an inorganic compound coating of a second metal. The dielectric film diminishes overall heat transfer from the first metal particle in the thermal interface material by a small fraction of total possible heat transfer without the dielectric film. A method of operating the chip includes biasing the chip with the dielectric film in place.
摘要翻译： 芯片封装包括设置在模具背面和散热器之间的热界面材料。 热界面材料包括由电介质膜覆盖的第一金属颗粒。 电介质膜选自第一金属的无机化合物或第二金属的无机化合物涂层。 电介质膜减少热界面材料中的第一金属颗粒的总传热量，而不需要电介质膜的总可能传热的一小部分。 一种操作该芯片的方法包括：将该电介质膜的芯片偏压就位。
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公开(公告)号：US20150255415A1
公开(公告)日：2015-09-10
申请号：US14198479
申请日：2014-03-05
申请人： Thomas J. De Bonis , Lilia May , Rajen S. Sidhu , Mukul P. Renavikar , Ashay A. Dani , Edward R. Prack , Carl L. Deppisch , Anna M. Prakash , James C. Matayabas, JR. , Jason Jieping Zhang , Srinivasa R. Aravamudhan , Chang Lin
发明人： Thomas J. De Bonis , Lilia May , Rajen S. Sidhu , Mukul P. Renavikar , Ashay A. Dani , Edward R. Prack , Carl L. Deppisch , Anna M. Prakash , James C. Matayabas, JR. , Jason Jieping Zhang , Srinivasa R. Aravamudhan , Chang Lin
IPC分类号： H01L23/00 , H01L25/065 , H01L23/498 , H01L23/31 , H01L21/56 , H01L21/768
CPC分类号： H01L23/49816 , H01L21/4853 , H01L21/565 , H01L21/76802 , H01L23/3128 , H01L23/49822 , H01L24/16 , H01L24/17 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2224/13023 , H01L2224/16227 , H01L2224/16238 , H01L2225/06513 , H01L2225/06517 , H01L2225/0652 , H01L2225/06548 , H01L2225/06586 , H01L2225/1023 , H01L2225/1058 , H01L2924/12042 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/1815 , H01L2924/37001 , H01L2924/00
摘要： An apparatus is described that includes a substrate and a mold compound disposed on the substrate. The semiconductor die is embedded within the mold compound and is electrically coupled to lands on the substrate. Solder balls are disposed around the semiconductor die on the substrate. Each of the solder balls have a solid coating thereon. The solid coating contains a cleaning agent to promote its solder ball's coalescence with another solder ball. Respective vias are formed in the mold compound that expose the solder balls and their respective solid coatings. In combined or alternate embodiments outer edges of the mold compound have smaller thickness than regions of the mold compound between the vias and the semiconductor die. In combined or alternate embodiments micro-channels exist between the solder balls and the mold compound.
摘要翻译： 描述了一种包括设置在基板上的基板和模具化合物的装置。 半导体管芯被嵌入在模具化合物内并且电耦合到衬底上的焊盘。 焊球围绕半导体管芯设置在基板上。 每个焊球上都有一个固体涂层。 固体涂层含有一种清洁剂，以促进其焊球与另一种焊球的聚结。 在模具化合物中形成了暴露焊球及其各自固体涂层的通孔。 在组合或替代实施例中，模具化合物的外边缘具有比通孔和半导体管芯之间的模具化合物区域更小的厚度。 在组合或替代实施例中，焊料球与模具化合物之间存在微通道。
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8.发明申请公开(公告)号：US20140264827A1
公开(公告)日：2014-09-18
申请号：US13795021
申请日：2013-03-12
IPC分类号： C08K5/00 , H01L23/498 , H01L21/78
CPC分类号： C08K5/005 , B23K26/18 , B23K26/364 , H01L21/563 , H01L21/78 , H01L2924/0002 , H01L2924/00
摘要： Methods of forming microelectronic packaging structures and associated structures formed thereby are described. Those methods and structures may include forming a wafer level underfill (WLUF) material comprising a resin material, and adding at least one of a UV absorber, a sterically hindered amine light stabilizer (HALS), an organic surface protectant (OSP), and a fluxing agent to form the WLUF material. The WLUF is then applied to a top surface of a wafer comprising a plurality of die.
摘要翻译： 描述形成微电子封装结构和由此形成的相关结构的方法。 这些方法和结构可以包括形成包含树脂材料的晶片级底层填料（WLUF）材料，并加入紫外线吸收剂，空间位阻胺光稳定剂（HALS），有机表面保护剂（OSP）和 助熔剂以形成WLUF材料。 然后将WLUF施加到包括多个管芯的晶片的顶表面。
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公开(公告)号：US20080156852A1
公开(公告)日：2008-07-03
申请号：US11617811
申请日：2006-12-29
申请人： Anna M. Prakash
发明人： Anna M. Prakash
IPC分类号： B23K35/362 , B23K31/02
CPC分类号： B23K35/362 , B23K35/3613 , B23K35/3618
摘要： A solder flux composition is formulated to lower contact wetting angles on bond pads, and to remain stable until the reflow temperature of the solder. A process includes contacting a bond pad with the solder flux composition and reflowing the solder bump that is in contact with the bond pad and the solder flux composition.
摘要翻译： 配制焊剂组合物以降低接合焊盘上的接触润湿角度，并保持稳定直到焊料的回流温度。 一种方法包括使接合焊盘与焊剂组合物接触并回流与接合焊盘和焊剂组合物接触的焊料凸块。
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10.发明授权Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing same 有权具有用于体偏置的电介质障碍物的芯片封装热界面材料，其使用方法以及含有它们的体系公开(公告)号：US07332807B2
公开(公告)日：2008-02-19
申请号：US11323512
申请日：2005-12-30
CPC分类号： H01L23/3737 , H01L2224/05571 , H01L2224/05573 , H01L2224/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/2929 , H01L2224/293 , H01L2224/29486 , H01L2224/2949 , H01L2224/29499 , H01L2224/32245 , H01L2224/73253 , H01L2924/00014 , H01L2924/01079 , H01L2924/01327 , H01L2924/15311 , H01L2924/16152 , H01L2924/00 , H01L2224/05599
摘要： A chip package includes a thermal interface material disposed between a die backside and a heat sink. The thermal interface material includes a first metal particle that is covered by a dielectric film. The dielectric film is selected from an inorganic compound of the first metal or an inorganic compound coating of a second metal. The dielectric film diminishes overall heat transfer from the first metal particle in the thermal interface material by a small fraction of total possible heat transfer without the dielectric film. A method of operating the chip includes biasing the chip with the dielectric film in place.
摘要翻译： 芯片封装包括设置在模具背面和散热器之间的热界面材料。 热界面材料包括由电介质膜覆盖的第一金属颗粒。 电介质膜选自第一金属的无机化合物或第二金属的无机化合物涂层。 电介质膜减少热界面材料中的第一金属颗粒的总传热量，而不需要电介质膜的总可能传热的一小部分。 一种操作该芯片的方法包括：将该电介质膜的芯片偏压就位。
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