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US08184449B2 Electronic device having stack-type semiconductor package and method of forming the same 有权
具有堆叠型半导体封装的电子器件及其形成方法

Electronic device having stack-type semiconductor package and method of forming the same
Abstract:
An electronic device includes a lower electronic part including a lower substrate, a lower chip structure disposed on the lower substrate, and a lower molding layer covering the lower chip structure and having a recessed region in an upper surface of the lower molding layer, and an upper electronic part including an upper substrate disposed on the lower electronic part, and an upper chip structure projecting from the upper substrate, wherein the recessed region of the lower molding layer receives the upper chip structure.
Abstract(Chinese):

电子设备包括下电子部件，其包括下基板，设置在下基板上的下芯片结构，以及覆盖下芯片结构的下成型层，并且在下成型层的上表面具有凹部， 上部电子部件，其包括设置在下部电子部件上的上部基板和从上部基板突出的上部芯片结构，其中下部成型层的凹部区域接收上部芯片结构。

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