发明授权
US08186051B2 Method for fabricating package substrate and die spacer layers having a ceramic backbone
有权
制造具有陶瓷骨架的封装衬底和管芯间隔层的方法
- 专利标题： Method for fabricating package substrate and die spacer layers having a ceramic backbone
- 专利标题（中）： 制造具有陶瓷骨架的封装衬底和管芯间隔层的方法
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申请号： US12079785申请日： 2008-03-28
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公开(公告)号： US08186051B2公开(公告)日： 2012-05-29
- 发明人: Aleksandar Aleksov , Vladimir Noveski , Sujit Sharan , Shankar Ganapathysubramanian
- 申请人： Aleksandar Aleksov , Vladimir Noveski , Sujit Sharan , Shankar Ganapathysubramanian
- 申请人地址： unknown Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： unknown Santa Clara
- 代理机构： Zea, Barlocci & Markvardsen
- 主分类号： H05K3/02
- IPC分类号： H05K3/02
摘要：
Methods for fabricating a layer or layers for use in package substrates and die spacers are described. In one implementation the layer or layers are fabricated to include a plurality of ceramic wells lying within a plane and separated by metallic via with recesses within the ceramic wells being occupied by a dielectric filler material.