Invention Grant
US08186051B2 Method for fabricating package substrate and die spacer layers having a ceramic backbone
有权
制造具有陶瓷骨架的封装衬底和管芯间隔层的方法
- Patent Title: Method for fabricating package substrate and die spacer layers having a ceramic backbone
- Patent Title (中): 制造具有陶瓷骨架的封装衬底和管芯间隔层的方法
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Application No.: US12079785Application Date: 2008-03-28
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Publication No.: US08186051B2Publication Date: 2012-05-29
- Inventor: Aleksandar Aleksov , Vladimir Noveski , Sujit Sharan , Shankar Ganapathysubramanian
- Applicant: Aleksandar Aleksov , Vladimir Noveski , Sujit Sharan , Shankar Ganapathysubramanian
- Applicant Address: unknown Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: unknown Santa Clara
- Agency: Zea, Barlocci & Markvardsen
- Main IPC: H05K3/02
- IPC: H05K3/02
Abstract:
Methods for fabricating a layer or layers for use in package substrates and die spacers are described. In one implementation the layer or layers are fabricated to include a plurality of ceramic wells lying within a plane and separated by metallic via with recesses within the ceramic wells being occupied by a dielectric filler material.
Public/Granted literature
- US20090242247A1 Package substrate and die spacer layers having a ceramic backbone Public/Granted day:2009-10-01
Information query
