Invention Grant
US08189194B2 Direct illumination machine vision technique for processing semiconductor wafers
有权
用于处理半导体晶片的直接照明机器视觉技术
- Patent Title: Direct illumination machine vision technique for processing semiconductor wafers
- Patent Title (中): 用于处理半导体晶片的直接照明机器视觉技术
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Application No.: US12209248Application Date: 2008-09-12
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Publication No.: US08189194B2Publication Date: 2012-05-29
- Inventor: John W. Schwab , Gang Liu , David J. Michael , Lei Wang
- Applicant: John W. Schwab , Gang Liu , David J. Michael , Lei Wang
- Applicant Address: US MA Natick
- Assignee: Cognex Corporation
- Current Assignee: Cognex Corporation
- Current Assignee Address: US MA Natick
- Agency: Quarles & Brady LLP
- Main IPC: G01B11/00
- IPC: G01B11/00

Abstract:
A vision system is provided to determine a positional relationship between a semiconductor wafer on a platen and an element on a processing machine, such as a printing screen, on a remote side of the semiconductor wafer from the platen. A source directs ultraviolet light through an aperture in the platen to illuminate the semiconductor wafer and cast a shadow onto the element adjacent an edge of the semiconductor wafer. A video camera produces an image using light received from the platen aperture, wherein some of that received light was reflected by the wafer. The edge of the semiconductor wafer in the image is well defined by a dark/light transition.
Public/Granted literature
- US20100065757A1 DIRECT ILLUMINATION MACHINE VISION TECHNIQUE FOR PROCESSING SEMICONDUCTOR WAFERS Public/Granted day:2010-03-18
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