Invention Grant
- Patent Title: Printed circuit board for memory module, method of manufacturing the same and memory module/socket assembly
- Patent Title (中): 内存模块印制电路板，制造方法及内存模块/插座组件
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Application No.: US11500960Application Date: 2006-08-09
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Publication No.: US08189342B2Publication Date: 2012-05-29
- Inventor: Hyo-Jae Bang , Dong-Chun Lee , Ho-Geon Song , Seong-Chan Han , Kwang-Su Yu , Dong-Woo Shin
- Applicant: Hyo-Jae Bang , Dong-Chun Lee , Ho-Geon Song , Seong-Chan Han , Kwang-Su Yu , Dong-Woo Shin
- Applicant Address: KR Gyeonggi-Do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-Do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2005-0074480 20050812
- Main IPC: H05K1/14
- IPC: H05K1/14
Abstract:
Example embodiments of the present invention may include a printed circuit board, a method of manufacturing the printed circuit board, and a memory module/socket assembly. Example embodiments of the present invention may increase the number of contact taps on a memory module, in addition, a force required to insert the memory module into a module socket may be decreased.
Public/Granted literature
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