Invention Grant
- Patent Title: Magnetic assembly and fabricating method thereof
- Patent Title (中): 磁性组装及其制造方法
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Application No.: US12827205Application Date: 2010-06-30
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Publication No.: US08193895B2Publication Date: 2012-06-05
- Inventor: Tsung-Hsiao Wu , Ching-Hsien Teng , Kao-Tsai Liao , Zhi-Liang Zhang , Tian-Chang Lin , Ming Yeh
- Applicant: Tsung-Hsiao Wu , Ching-Hsien Teng , Kao-Tsai Liao , Zhi-Liang Zhang , Tian-Chang Lin , Ming Yeh
- Applicant Address: TW Taoyuan Hsien
- Assignee: Delta Electronics, Inc.
- Current Assignee: Delta Electronics, Inc.
- Current Assignee Address: TW Taoyuan Hsien
- Agency: Kirton McConkie
- Agent Evan R. Witt
- Priority: TW98122326A 20090701
- Main IPC: H01F27/30
- IPC: H01F27/30 ; H01F5/00 ; H01F7/06

Abstract:
A magnetic assembly includes a magnetic core, a circuit board and multiple conductive elements. The circuit board includes multiple conductive regions. The conductive elements stride over the magnetic core. Each of the conductive elements includes a first terminal, a second terminal and a connecting part. The connecting part is arranged between the first terminal and the second terminal for connecting the first terminal with the second terminal. The first terminal and the second terminal of each conductive element are respectively connected to two adjacent conductive regions. The multiple conductive elements and the multiple conductive regions collectively define multiple loops. The multiple loops interact with the magnetic core to generate inductance.
Public/Granted literature
- US20110001590A1 MAGNETIC ASSEMBLY AND FABRICATING METHOD THEREOF Public/Granted day:2011-01-06
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