发明授权
US08198551B2 Power core for use in circuitized substrate and method of making same
有权
用于电路化基板的电源芯及其制造方法
- 专利标题: Power core for use in circuitized substrate and method of making same
- 专利标题(中): 用于电路化基板的电源芯及其制造方法
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申请号: US12782187申请日: 2010-05-18
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公开(公告)号: US08198551B2公开(公告)日: 2012-06-12
- 发明人: Robert M. Japp , Kostas Papathomas , John Steven Kresge , Timothy Antesberger
- 申请人: Robert M. Japp , Kostas Papathomas , John Steven Kresge , Timothy Antesberger
- 申请人地址: US NY Endicott
- 专利权人: Endicott Interconnect Technologies, Inc.
- 当前专利权人: Endicott Interconnect Technologies, Inc.
- 当前专利权人地址: US NY Endicott
- 代理机构: Hinman, Howard & Kattell
- 代理商 Mark Levy; Lawrence R. Fraley
- 主分类号: H05K1/11
- IPC分类号: H05K1/11
摘要:
A power core adapted for use as part of a circuitized substrate, e.g., a PCB or LCC. The core includes a first layer of low expansion dielectric and two added layers of a different low expansion dielectric bonded thereto, with two conductive layers positioned on the two added low expansion dielectric layers. At least one of the conductive layers serves as a power plane for the power core, which in turn is usable within a circuitized substrate, also provided. Methods of making the power core and circuitized substrate are also provided. The use of different low expansion dielectric materials for the power core enables the use of support enhancing fiberglass in one layer while such use is precluded in the other two dielectric layers, thus preventing CAF shorting problems in highly precisely defined thru holes formed within the power core.