发明授权
- 专利标题: Inspection apparatus and inspection method
- 专利标题(中): 检验仪器和检验方法
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申请号: US12350581申请日: 2009-01-08
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公开(公告)号: US08203705B2公开(公告)日: 2012-06-19
- 发明人: Masami Ooyama , Masayuki Hachiya , Kazuhiro Zama , Keiichi Nagasaki
- 申请人: Masami Ooyama , Masayuki Hachiya , Rieko Hachiya, legal representative , Kimiko Hachiya, legal representative , Kazuhiro Zama , Keiichi Nagasaki
- 申请人地址: JP Tokyo
- 专利权人: Hitachi-High Technologies Corporation
- 当前专利权人: Hitachi-High Technologies Corporation
- 当前专利权人地址: JP Tokyo
- 代理机构: McDermott Will & Emery LLP
- 优先权: JP2008-003807 20080111
- 主分类号: G01N21/00
- IPC分类号: G01N21/00
摘要:
The invention is directed to detect a warp amount in a real-time manner in a wafer rotating at high speed under inspection. An inspection apparatus includes: a first light irradiating unit for irradiating an object to be inspected with light; a first detector for detecting scattered light from the object to be inspected; a second light irradiating unit for irradiating the object to be inspected with light; a second detector for detecting light reflected from the object to be inspected, of light of the second light irradiating unit; a stage for moving an object to be inspected, which moves the object to be inspected so as to change irradiation positions on the object to be inspected, of the light of the first light irradiating unit and the light of the second light irradiating unit; an inspection coordinate detector for outputting information of coordinates of a position irradiated with light; an elevation control circuit for outputting height information of the object to be inspected on the basis of a detection signal from the second detector; and a data processing unit for calculating a warp amount of the object to be inspected on the basis of the information of the position coordinates from the inspection coordinate detector and the height information from the elevation control circuit.
公开/授权文献
- US20090187354A1 INSPECTION APPARATUS AND INSPECTION METHOD 公开/授权日:2009-07-23