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公开(公告)号：US08203705B2
公开(公告)日：2012-06-19
申请号：US12350581
申请日：2009-01-08
申请人： Masami Ooyama , Masayuki Hachiya , Rieko Hachiya, legal representative , Kimiko Hachiya, legal representative , Kazuhiro Zama , Keiichi Nagasaki
IPC分类号： G01N21/00
CPC分类号： G01N21/01 , G01B11/306 , G01N21/9501 , H01L21/68721 , H01L21/68735
摘要： The invention is directed to detect a warp amount in a real-time manner in a wafer rotating at high speed under inspection. An inspection apparatus includes: a first light irradiating unit for irradiating an object to be inspected with light; a first detector for detecting scattered light from the object to be inspected; a second light irradiating unit for irradiating the object to be inspected with light; a second detector for detecting light reflected from the object to be inspected, of light of the second light irradiating unit; a stage for moving an object to be inspected, which moves the object to be inspected so as to change irradiation positions on the object to be inspected, of the light of the first light irradiating unit and the light of the second light irradiating unit; an inspection coordinate detector for outputting information of coordinates of a position irradiated with light; an elevation control circuit for outputting height information of the object to be inspected on the basis of a detection signal from the second detector; and a data processing unit for calculating a warp amount of the object to be inspected on the basis of the information of the position coordinates from the inspection coordinate detector and the height information from the elevation control circuit.
摘要翻译： 本发明涉及在检查中以高速旋转的晶片中实时检测翘曲量。 检查装置包括：第一光照射单元，用于用光照射被检查物体; 用于检测来自被检查物体的散射光的第一检测器; 第二光照射单元，用于用光照射被检查物体; 第二检测器，用于检测来自被检查物体的光的第二光照射单元的光; 用于使被检查物体移动以移动要检查的物体，以便改变第一光照射单元的光和第二光照射单元的光的待检查对象的照射位置的台阶; 用于输出用光照射的位置的坐标信息的检查坐标检测器; 高度控制电路，用于根据来自第二检测器的检测信号输出待检查物体的高度信息; 以及数据处理单元，用于根据来自检查坐标检测器的位置坐标的信息和来自仰角控制电路的高度信息来计算被检查物体的弯曲量。
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公开(公告)号：US20090187354A1
公开(公告)日：2009-07-23
申请号：US12350581
申请日：2009-01-08
申请人： Masami Ooyama , Masayuki Hachiya , Rieko Hachiya , Kimiko Hachiya , Kazuhiro Zama , Keiichi Nagasaki
发明人： Masami Ooyama , Masayuki Hachiya , Rieko Hachiya , Kimiko Hachiya , Kazuhiro Zama , Keiichi Nagasaki
CPC分类号： G01N21/01 , G01B11/306 , G01N21/9501 , H01L21/68721 , H01L21/68735
摘要： The invention is directed to detect a warp amount in a real-time manner in a wafer rotating at high speed under inspection. An inspection apparatus includes: a first light irradiating unit for irradiating an object to be inspected with light; a first detector for detecting scattered light from the object to be inspected; a second light irradiating unit for irradiating the object to be inspected with light; a second detector for detecting light reflected from the object to be inspected, of light of the second light irradiating unit; a stage for moving an object to be inspected, which moves the object to be inspected so as to change irradiation positions on the object to be inspected, of the light of the first light irradiating unit and the light of the second light irradiating unit; an inspection coordinate detector for outputting information of coordinates of a position irradiated with light; an elevation control circuit for outputting height information of the object to be inspected on the basis of a detection signal from the second detector; and a data processing unit for calculating a warp amount of the object to be inspected on the basis of the information of the position coordinates from the inspection coordinate detector and the height information from the elevation control circuit.
摘要翻译： 本发明涉及在检查中以高速旋转的晶片中实时检测翘曲量。 检查装置包括：第一光照射单元，用于用光照射被检查物体; 用于检测来自被检查物体的散射光的第一检测器; 第二光照射单元，用于用光照射被检查物体; 第二检测器，用于检测来自被检查物体的光的第二光照射单元的光; 用于使被检查物体移动以移动要检查的物体，以便改变第一光照射单元的光和第二光照射单元的光的待检查对象的照射位置的台阶; 用于输出用光照射的位置的坐标信息的检查坐标检测器; 高度控制电路，用于根据来自第二检测器的检测信号输出待检查物体的高度信息; 以及数据处理单元，用于根据来自检查坐标检测器的位置坐标的信息和来自仰角控制电路的高度信息来计算被检查物体的弯曲量。
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公开(公告)号：US08537351B2
公开(公告)日：2013-09-17
申请号：US13473314
申请日：2012-05-16
IPC分类号： G01N21/01
CPC分类号： G01N21/01 , G01B11/306 , G01N21/9501 , H01L21/68721 , H01L21/68735
摘要： An object mounting mechanism includes: a plate member on which an object is mounted. Bumps are arranged on an upper surface of the plate member which faces a reverse face of the object. In addition, the bumps are arranged sparsely in an area of a surrounding part of the plate member and densely toward an area of a center part of the plate member.
摘要翻译： 物体安装机构包括：安装有物体的板构件。 凸起布置在板构件的面对物体的反面的上表面上。 此外，凸块在板构件的周围部分的区域中稀疏地排列，并且密集地朝向板构件的中心部分的区域。
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公开(公告)号：US20120287425A1
公开(公告)日：2012-11-15
申请号：US13473314
申请日：2012-05-16
申请人： Masami OOYAMA , Masayuki HACHIYA , Rieko HACHIYA , Kimiko HACHIYA , Kazuhiro ZAMA , Keiichi NAGASAKI
发明人： Masami OOYAMA , Masayuki HACHIYA , Rieko HACHIYA , Kimiko HACHIYA , Kazuhiro ZAMA , Keiichi NAGASAKI
CPC分类号： G01N21/01 , G01B11/306 , G01N21/9501 , H01L21/68721 , H01L21/68735
摘要： An object mounting mechanism includes: a plate member on which an object is mounted. Bumps are arranged on an upper surface of the plate member which faces a reverse face of the object. In addition, the bumps are arranged sparsely in an area of a surrounding part of the plate member and densely toward an area of a center part of the plate member.
摘要翻译： 物体安装机构包括：安装有物体的板构件。 凸起布置在板构件的面对物体的反面的上表面上。 此外，凸块在板构件的周围部分的区域中稀疏地排列，并且密集地朝向板构件的中心部分的区域。
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