Invention Grant
- Patent Title: Apparatus for attaching substrates
- Patent Title (中): 用于安装基板的装置
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Application No.: US12260652Application Date: 2008-10-29
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Publication No.: US08205653B2Publication Date: 2012-06-26
- Inventor: Dong Gun Kim , Bong Hwan Choi
- Applicant: Dong Gun Kim , Bong Hwan Choi
- Applicant Address: KR Seongnam-si
- Assignee: Advanced Display Process Engineering, Co., Ltd.
- Current Assignee: Advanced Display Process Engineering, Co., Ltd.
- Current Assignee Address: KR Seongnam-si
- Agency: KED & Associates, LLP
- Priority: KR10-2007-0111671 20071102
- Main IPC: B29C65/00
- IPC: B29C65/00 ; B29C65/08 ; B32B37/00 ; B32B38/04 ; B32B41/00 ; G05G15/00 ; B65C9/40 ; B23K37/00 ; B30B5/02 ; B30B5/04 ; B30B15/34
Abstract:
A substrate bonding apparatus and method are provided. The substrate bonding apparatus may include a first support member that receives a first substrate, a second support member that receives a second substrate opposite the first support member, and a support pin located at the outside of the first substrate fixed to the first support member. The support pin may be connected to the first support member, and a distance adjustment device may move the support pin upward or downward to adjust the distance between the first support member and the second support member.
Public/Granted literature
- US20090114350A1 APPARATUS FOR ATTACHING SUBSTRATES Public/Granted day:2009-05-07
Information query
