发明授权
- 专利标题: Method of manufacturing nonvolatile semiconductor device
- 专利标题(中): 非易失性半导体器件的制造方法
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申请号: US12727890申请日: 2010-03-19
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公开(公告)号: US08211777B2公开(公告)日: 2012-07-03
- 发明人: Yasuaki Yonemochi , Hisakazu Otoi , Akio Nishida , Shigeru Shiratake
- 申请人: Yasuaki Yonemochi , Hisakazu Otoi , Akio Nishida , Shigeru Shiratake
- 申请人地址: JP Kanagawa
- 专利权人: Renesas Electronics Corporation
- 当前专利权人: Renesas Electronics Corporation
- 当前专利权人地址: JP Kanagawa
- 代理机构: McDermott Will & Emery LLP
- 优先权: JP2005-118505 20050415
- 主分类号: H01L21/76
- IPC分类号: H01L21/76
摘要:
A semiconductor substrate having a main surface, first and second floating gates formed spaced apart from each other on the main surface of the semiconductor substrate, first and second control gates respectively located on the first and second floating gates, a first insulation film formed on the first control gate, a second insulation film formed on the second control gate to contact the first insulation film, and a gap portion formed at least between the first floating gate and the second floating gate by achieving contact between the first insulation film and the second insulation film are included. With this, a function of a nonvolatile semiconductor device can be ensured and a variation in a threshold voltage of a floating gate can be suppressed.
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