Invention Grant
- Patent Title: Systems and methods for coupling conductors to conductive contacts of electrical stimulation systems
- Patent Title (中): 将导体耦合到电刺激系统的导电触点的系统和方法
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Application No.: US12419763Application Date: 2009-04-07
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Publication No.: US08214054B2Publication Date: 2012-07-03
- Inventor: John Michael Barker
- Applicant: John Michael Barker
- Applicant Address: US CA Valencia
- Assignee: Boston Scientific Neuromodulation Corporation
- Current Assignee: Boston Scientific Neuromodulation Corporation
- Current Assignee Address: US CA Valencia
- Agency: Frommer Lawrence & Haug LLP
- Agent Patrick R. Turner
- Main IPC: A61N1/04
- IPC: A61N1/04

Abstract:
An electrical stimulation lead includes a plurality of conductive contacts disposed at a distal end and a proximal end of a lead body. The plurality of conductive contacts includes a plurality of electrodes and a plurality of terminals. At least one of the conductive contacts is a first conductive contact that includes at least one adhesive aperture defined between an inner surface and an outer surface of the at least one conductive contact. A plurality of conductors each electrically couple at least one of the electrodes to at least one of the terminals. Each first conductive contact has a conductor associated with, and electrically coupled to that first conductive contact. The adhesive is disposed in proximity to the at least one adhesive aperture of at least one first conductive contact to adhesively couple that first conductive contact to the at least one associated conductor.
Public/Granted literature
- US20100256694A1 SYSTEMS AND METHODS FOR COUPLING CONDUCTORS TO CONDUCTIVE CONTACTS OF ELECTRICAL STIMULATION SYSTEMS Public/Granted day:2010-10-07
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