Invention Grant
- Patent Title: Rotational-flow spray nozzle and process of using same
- Patent Title (中): 旋转喷嘴及其使用过程
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Application No.: US11613490Application Date: 2006-12-20
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Publication No.: US08215536B2Publication Date: 2012-07-10
- Inventor: Harikrishnan Ramanan , Nitin Deshpande , Sabina J. Houle
- Applicant: Harikrishnan Ramanan , Nitin Deshpande , Sabina J. Houle
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Konrad Raynes & Victor LLP
- Agent Alan S. Raynes
- Main IPC: B23K1/20
- IPC: B23K1/20
Abstract:
A solder-flux composition is sprayed onto a substrate by rotating the solder-flux composition inside a spray cap, and before the solder-flux liquid exits the spray cap, perturbing the flow thereof with a fluid.
Public/Granted literature
- US20080149692A1 ROTATIONAL-FLOW SPRAY NOZZLE AND PROCESS OF USING SAME Public/Granted day:2008-06-26
Information query
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