Invention Grant
US08215964B2 Connectors and assemblies having a plurality of moveable mating arrays
有权
具有多个可移动配合阵列的连接器和组件
- Patent Title: Connectors and assemblies having a plurality of moveable mating arrays
- Patent Title (中): 具有多个可移动配合阵列的连接器和组件
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Application No.: US12686518Application Date: 2010-01-13
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Publication No.: US08215964B2Publication Date: 2012-07-10
- Inventor: Richard Elof Hamner , Robert Neil Mulfinger , Jason M'Cheyne Reisinger , Attalee S. Taylor
- Applicant: Richard Elof Hamner , Robert Neil Mulfinger , Jason M'Cheyne Reisinger , Attalee S. Taylor
- Applicant Address: US PA Berwyn
- Assignee: Tyco Electronics Corporation
- Current Assignee: Tyco Electronics Corporation
- Current Assignee Address: US PA Berwyn
- Main IPC: H01R13/15
- IPC: H01R13/15

Abstract:
A connector configured to communicatively couple different components. The connector includes a base frame that extends along a longitudinal axis between a pair of frame ends and first and second moveable mating arrays having mating surfaces with terminals arranged thereon. The connector also includes a coupling mechanism that is supported by the base frame. The coupling mechanism holds the first and second mating arrays so that the mating surfaces of the first and second mating arrays extend along the longitudinal axis. The coupling mechanism moves the first and second mating arrays along different mating directions with respect to select components. The coupling mechanism moves the first and second mating arrays between retracted and engaged positions, wherein the corresponding mating array is spaced apart from the select component in the retracted position and engaged to the select component in the engaged position.
Public/Granted literature
- US20110170827A1 CONNECTORS AND ASSEMBLIES HAVING A PLURALITY OF MOVEABLE MATING ARRAYS Public/Granted day:2011-07-14
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