Invention Grant
- Patent Title: Method of manufacturing inkjet printhead
- Patent Title (中): 制造喷墨打印头的方法
-
Application No.: US12428808Application Date: 2009-04-23
-
Publication No.: US08216482B2Publication Date: 2012-07-10
- Inventor: Jong-Seok Kim , Yong-Seop Yoon , Moon-Chul Lee , Yong-Won Jeong , Dong-Sik Shim , Hyung Choi
- Applicant: Jong-Seok Kim , Yong-Seop Yoon , Moon-Chul Lee , Yong-Won Jeong , Dong-Sik Shim , Hyung Choi
- Applicant Address: KR Suwon-Si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-Si
- Agency: Staas & Halsey LLP
- Priority: KR10-2008-0086287 20080902
- Main IPC: G01D15/00
- IPC: G01D15/00 ; G11B5/127 ; C23F1/00 ; H01L21/00 ; H01L21/311

Abstract:
A method of manufacturing an inkjet printhead includes forming a chamber layer having multiple ink chambers on a substrate. A sacrificial layer is formed and is configured to fill a space associated with the ink chambers on the chamber layer. A nozzle layer is formed on the top surfaces of the chamber layer and the sacrificial layer and having multiple nozzles. An etching mask is prepared on the bottom surface of the substrate. The etching mask has at least one linear etching pattern configured to define a portion of the substrate in which an ink feed hole is to be formed. The substrate is etched through the linear etching pattern until the sacrificial layer is exposed and a through hole is formed. The through hole defines the portion of the substrate in which the ink feed hole is to be formed. The sacrificial layer and the portion of the substrate surrounded by the through hole are removed to form the ink feed hole.
Public/Granted literature
- US20100051580A1 METHOD OF MANUFACTURING INKJET PRINTHEAD Public/Granted day:2010-03-04
Information query